{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,29]],"date-time":"2026-08-29T18:04:44Z","timestamp":1788026684470,"version":"build-2784847793"},"reference-count":62,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100000780","name":"European Commission H2020 CONNECT Project","doi-asserted-by":"publisher","award":["688612"],"award-info":[{"award-number":["688612"]}],"id":[{"id":"10.13039\/501100000780","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Marie Sk\u0142odowska\u2013Curie Individual Fellowship","award":["894805"],"award-info":[{"award-number":["894805"]}]},{"name":"Marie Sk\u0142odowska\u2013Curie Individual Fellowship","award":["H-3D-SOC"],"award-info":[{"award-number":["H-3D-SOC"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2022,4]]},"DOI":"10.1109\/tvlsi.2022.3146125","type":"journal-article","created":{"date-parts":[[2022,2,17]],"date-time":"2022-02-17T15:27:12Z","timestamp":1645111632000},"page":"432-439","source":"Crossref","is-referenced-by-count":31,"title":["Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation\u2014Part I: CNFET Transistor Optimization"],"prefix":"10.1109","volume":"30","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1205-0585","authenticated-orcid":false,"given":"Rongmei","family":"Chen","sequence":"first","affiliation":[{"name":"IMEC, Leuven, Belgium"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lin","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Beihang University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0595-8598","authenticated-orcid":false,"given":"Jie","family":"Liang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Shanghai University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2477-314X","authenticated-orcid":false,"given":"Yuanqing","family":"Cheng","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Beihang University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Souhir","family":"Elloumi","sequence":"additional","affiliation":[{"name":"Microelectronics Department, LIRMM, CNRS, University of Montpellier, Montpellier, France"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8322-1524","authenticated-orcid":false,"given":"Jaehyun","family":"Lee","sequence":"additional","affiliation":[{"name":"Synopsys, Ltd., Glasgow, U.K."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kangwei","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Beihang University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6473-2508","authenticated-orcid":false,"given":"Vihar P.","family":"Georgiev","sequence":"additional","affiliation":[{"name":"School of Engineering, University of Glasgow, Glasgow, U.K."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3628-3431","authenticated-orcid":false,"given":"Kai","family":"Ni","sequence":"additional","affiliation":[{"name":"Department of Microsystems, Rochester Institute of Technology, Rochester, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3825-5554","authenticated-orcid":false,"given":"Peter","family":"Debacker","sequence":"additional","affiliation":[{"name":"IMEC, Leuven, Belgium"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Asen","family":"Asenov","sequence":"additional","affiliation":[{"name":"School of Engineering, University of Glasgow, Glasgow, U.K."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8573-2910","authenticated-orcid":false,"given":"Aida","family":"Todri-Sanial","sequence":"additional","affiliation":[{"name":"Microelectronics Department, LIRMM, CNRS, University of Montpellier, Montpellier, France"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1126\/science.aab2750"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2010.89"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2014.283"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2018.2871841"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2010.220"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1126\/science.aaj1628"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1126\/science.aap9195"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1021\/jz4013596"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-019-1493-8"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-017-0003-y"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/nature22994"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371905"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/electronics9122110"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/SOCDC.2008.4815601"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2609386"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2014.6948971"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2363117"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2012.2197636"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/SOCDC.2008.4815599"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2009.2025128"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIT.2019.8776563"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2350674"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1021\/nl302015v"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614572"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2457453"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2457424"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/GAAS.2000.906261"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2016.04.006"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2017.2712365"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2008.4641513"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2163820"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.5772\/6747"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2014.6946036"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.5772\/17679"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2017.8050316"},{"key":"ref36","first-page":"497","article-title":"Array in subsystems","volume-title":"CMOS VLSI Design: A Circuits and Systems Perspective","author":"Weste","year":"2010"},{"key":"ref37","article-title":"A study of the effects of variability on performance of CNFET based digital circuits","author":"Shahidipour","year":"2012"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/NANONET.2006.346227"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2007.902047"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2009.2027615"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.81.2506"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1126\/science.aba5980"},{"key":"ref43","volume-title":"Stanford Virtual-Source Carbon Nanotube Field-Effect Transistors Model","author":"Lee","year":"2015"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1063\/1.1888054"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2084351"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.5120\/ijca2015906573"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1021\/nl0627745"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720672"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373591"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2012.257"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268335"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.2976734"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3045417"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2362842"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3146064"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268502"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2018.2802320"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342144"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2868421"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2868424"},{"key":"ref61","volume-title":"Multi-Walled\/Single-Walled Carbon Nanotube (MWCNT\/SWCNT) Interconnect Lumped Compact Model Considering Defects, Contact Resistance and Doping Impact","author":"Chen","year":"2018"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2901658"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9739817\/09715718.pdf?arnumber=9715718","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,6]],"date-time":"2025-10-06T17:41:43Z","timestamp":1759772503000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9715718\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4]]},"references-count":62,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2022.3146125","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,4]]}}}