{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,26]],"date-time":"2026-06-26T14:09:27Z","timestamp":1782482967592,"version":"3.54.5"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2022,5,1]],"date-time":"2022-05-01T00:00:00Z","timestamp":1651363200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,5,1]],"date-time":"2022-05-01T00:00:00Z","timestamp":1651363200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,1]],"date-time":"2022-05-01T00:00:00Z","timestamp":1651363200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62004024"],"award-info":[{"award-number":["62004024"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Science and Technology on Analog Integrated Circuit Laboratory","award":["JCKY201924B004"],"award-info":[{"award-number":["JCKY201924B004"]}]},{"name":"Science and Technology Projects of Sichuan Province","award":["2021YFG0146"],"award-info":[{"award-number":["2021YFG0146"]}]},{"name":"Science and Technology Projects of Sichuan Province","award":["2021YFG0004"],"award-info":[{"award-number":["2021YFG0004"]}]},{"name":"Opening Project of State Key Laboratory of Electronic Thin Films and Integrated Devices","award":["KFJJ202007"],"award-info":[{"award-number":["KFJJ202007"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2022,5]]},"DOI":"10.1109\/tvlsi.2022.3156612","type":"journal-article","created":{"date-parts":[[2022,3,17]],"date-time":"2022-03-17T20:22:46Z","timestamp":1647548566000},"page":"644-655","source":"Crossref","is-referenced-by-count":38,"title":["A 12-Bit Two-Step Single-Slope ADC With a Constant Input-Common-Mode Level Resistor Ramp Generator"],"prefix":"10.1109","volume":"30","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7015-2059","authenticated-orcid":false,"given":"Qihui","family":"Zhang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7893-1428","authenticated-orcid":false,"given":"Ning","family":"Ning","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2611-9424","authenticated-orcid":false,"given":"Zhong","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9980-0224","authenticated-orcid":false,"given":"Jing","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5472-0570","authenticated-orcid":false,"given":"Kejun","family":"Wu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qi","family":"Yu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2345018"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2238674"},{"key":"ref3","first-page":"287","article-title":"Infrared focal plane array readout integrated circuit with on-chip 14b A\/D converter","volume-title":"Proc. SPIE","volume":"5234","author":"Kang"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2198350"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2192662"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2013.2244317"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2387531"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2015.2457812"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2998473"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2164298"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2451700"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2332885"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2580712"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3013691"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3137540"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2006.1696261"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.884868"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.923434"},{"key":"ref19","first-page":"420","article-title":"A 17.7 Mpixel 120 fps CMOS image sensor with 34.8Gb\/s readout","volume-title":"IEEE ISSCC Dig. Tech. Papers","author":"Toyama"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2979321"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.908720"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2008.2011846"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2451791"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2019.2957043"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2959486"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.3025153"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2856851"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.2008510"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/4.173122"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2331111"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2985816"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2206684"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.908690"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/81.948432"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.891496"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2005.858136"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1002\/9780470891179.ch5"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.819163"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.906200"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9761844\/09737220.pdf?arnumber=9737220","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,18]],"date-time":"2024-01-18T00:32:50Z","timestamp":1705537970000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9737220\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5]]},"references-count":39,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2022.3156612","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,5]]}}}