{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:07:20Z","timestamp":1781885240831,"version":"3.54.5"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004663","name":"Ministry of Science and Technology, Taiwan","doi-asserted-by":"publisher","award":["MOST 110-2622-8-007-018"],"award-info":[{"award-number":["MOST 110-2622-8-007-018"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004663","name":"Ministry of Science and Technology, Taiwan","doi-asserted-by":"publisher","award":["MOST 111-2218-E-007-009"],"award-info":[{"award-number":["MOST 111-2218-E-007-009"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Taiwan Semiconductor Research Institute (TSRI) for chip fabrication"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2023,1]]},"DOI":"10.1109\/tvlsi.2022.3218741","type":"journal-article","created":{"date-parts":[[2022,11,9]],"date-time":"2022-11-09T20:40:28Z","timestamp":1668026428000},"page":"147-151","source":"Crossref","is-referenced-by-count":20,"title":["Implementation of a Multipath Fully Differential OTA in 0.18-\u03bcm CMOS Process"],"prefix":"10.1109","volume":"31","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4251-1138","authenticated-orcid":false,"given":"Meysam","family":"Akbari","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, University of Kurdistan, Sanandaj, Iran"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Safwan Mawlood","family":"Hussein","sequence":"additional","affiliation":[{"name":"Department of Computer Engineering, Faculty of Engineering, Tishk International University, Erbil, Iraq"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1989-0229","authenticated-orcid":false,"given":"Yasir","family":"Hashim","sequence":"additional","affiliation":[{"name":"Department of Computer Engineering, Faculty of Engineering, Tishk International University, Erbil, Iraq"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9864-9830","authenticated-orcid":false,"given":"Fabian","family":"Khateb","sequence":"additional","affiliation":[{"name":"Department of Microelectronics, Brno University of Technology, Brno, Czech Republic"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6315-9292","authenticated-orcid":false,"given":"Tomasz","family":"Kulej","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Czestochowa University of Technology, Czestochowa, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9689-1236","authenticated-orcid":false,"given":"Kea-Tiong","family":"Tang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2577838"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.3044608"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2024819"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IranianCEE.2014.6999507"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2019.152848"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2967870"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1080\/21681724.2017.1376710"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8350926"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2681964"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351610"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2742240"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2597440"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2988310"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2896457"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.845977"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2005.851387"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2896089"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2844371"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-015-0682-0"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2003.817847"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9998453\/09944072.pdf?arnumber=9944072","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T02:36:19Z","timestamp":1706754979000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9944072\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1]]},"references-count":20,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2022.3218741","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,1]]}}}