{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T11:59:32Z","timestamp":1777636772914,"version":"3.51.4"},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100002367","name":"Research Foundation of Strategic Priority Research Program of the Chinese Academy of Sciences","doi-asserted-by":"publisher","award":["XDA18030100"],"award-info":[{"award-number":["XDA18030100"]}],"id":[{"id":"10.13039\/501100002367","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shanghai Sailing Program","award":["22YF1456400"],"award-info":[{"award-number":["22YF1456400"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2023,10]]},"DOI":"10.1109\/tvlsi.2023.3288822","type":"journal-article","created":{"date-parts":[[2023,7,10]],"date-time":"2023-07-10T19:59:22Z","timestamp":1689019162000},"page":"1614-1618","source":"Crossref","is-referenced-by-count":11,"title":["An Adaptive and Universal Timing Mismatch Estimation Method for TIADCs"],"prefix":"10.1109","volume":"31","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0899-6610","authenticated-orcid":false,"given":"Lin","family":"Sun","sequence":"first","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1261-0706","authenticated-orcid":false,"given":"Zhenwei","family":"Zhang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3814-4451","authenticated-orcid":false,"given":"Lili","family":"Lang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"given":"Tong","family":"Kang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0018-0091","authenticated-orcid":false,"given":"Wei","family":"Xiong","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6302-2405","authenticated-orcid":false,"given":"Yu","family":"Liu","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"given":"Wei","family":"Zhong","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4277-5547","authenticated-orcid":false,"given":"Yemin","family":"Dong","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1980.1051512"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2258814"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2009.2015206"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3082719"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2897759"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/icemi.2007.4351081"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2004.832781"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2089558"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3163431"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3023810"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2703141"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2645978"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3067355"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.918267"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/10261320\/10177692.pdf?arnumber=10177692","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,13]],"date-time":"2024-03-13T22:37:14Z","timestamp":1710369434000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10177692\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10]]},"references-count":14,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2023.3288822","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,10]]}}}