{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T16:27:24Z","timestamp":1783700844242,"version":"3.55.0"},"reference-count":60,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2023,11,1]],"date-time":"2023-11-01T00:00:00Z","timestamp":1698796800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,11,1]],"date-time":"2023-11-01T00:00:00Z","timestamp":1698796800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,11,1]],"date-time":"2023-11-01T00:00:00Z","timestamp":1698796800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62021004"],"award-info":[{"award-number":["62021004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61934006"],"award-info":[{"award-number":["61934006"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61574106"],"award-info":[{"award-number":["61574106"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Cooperation Program of XDU-Chongqing IC Innovation Research Institute","award":["CQIRI-2022CXY-Z05"],"award-info":[{"award-number":["CQIRI-2022CXY-Z05"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2023,11]]},"DOI":"10.1109\/tvlsi.2023.3307792","type":"journal-article","created":{"date-parts":[[2023,9,4]],"date-time":"2023-09-04T18:33:02Z","timestamp":1693852382000},"page":"1653-1664","source":"Crossref","is-referenced-by-count":4,"title":["Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method"],"prefix":"10.1109","volume":"31","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0915-9096","authenticated-orcid":false,"given":"Wei","family":"Xiong","sequence":"first","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6557-2286","authenticated-orcid":false,"given":"Gang","family":"Dong","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3156-0564","authenticated-orcid":false,"given":"Changle","family":"Zhi","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6882-4637","authenticated-orcid":false,"given":"Yang","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7764-1928","authenticated-orcid":false,"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9745-5404","authenticated-orcid":false,"given":"Yintang","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2387231"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1080\/00401706.2000.10485979"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2009.2038165"},{"key":"ref56","author":"schmidt","year":"1992","journal-title":"Understanding Industrial Designed Experiments"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2338862"},{"key":"ref59","first-page":"1","article-title":"Rectified linear units improve restricted Boltzmann machines","author":"nair","year":"2010","journal-title":"Proc ICML"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2773637"},{"key":"ref58","year":"2022","journal-title":"TensorFlow"},{"key":"ref53","first-page":"1","article-title":"A 45&8tilde;5 GHz broadband directional coupler on GaAs technology","author":"meng","year":"2019","journal-title":"Proc Int Conf Microw Millimeter Wave Technol (ICMMT'08)"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2011.2165961"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"ref55","year":"2022","journal-title":"ANSYS"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.bios.2018.01.061"},{"key":"ref54","year":"2022","journal-title":"Keysight"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2927553"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2568755"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2209206"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1587\/elex.18.20210515"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2008.921672"},{"key":"ref50","first-page":"106","author":"mongia","year":"1998","journal-title":"RF and Microwave Coupled-Line Circuits"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/61.772353"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2412958"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/PanPacific.2016.7428424"},{"key":"ref47","first-page":"14","author":"yegnanarayana","year":"2009","journal-title":"Artificial Neural Networks"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101910"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2359578"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2021.3091714"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2618383"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3061384"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2327277"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2614331"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2021.3119283"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3152169"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2506547"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2515419"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3151383"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2919606"},{"key":"ref35","doi-asserted-by":"crossref","first-page":"181","DOI":"10.1109\/TCPMT.2010.2101890","article-title":"High-frequency scalable electrical model and analysis of a through silicon via (TSV)","volume":"1","author":"kim","year":"2011","journal-title":"IEEE Trans Compon Packag Manuf Technol"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2076382"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2268869"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2010.2099203"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2017.2654068"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/22.769332"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2164915"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2012.2206816"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2071550"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2964574"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898570"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2019.2960884"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2014.2316251"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3068303"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3139327"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2504099"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2700022"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3094221"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2021.3095990"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2322819"},{"key":"ref27","first-page":"1","article-title":"Recent advance in neuro-transfer function-assisted yield-driven EM optimization","author":"zhang","year":"2021","journal-title":"Proc Int Appl Comput Electromagn Soc Symp (ACES)"},{"key":"ref29","first-page":"63","article-title":"A study of meandered microstrip coupler with high directivity","author":"wang","year":"2003","journal-title":"IEEE MTT-S Int Microw Symp Dig"},{"key":"ref60","article-title":"Adam: A method for stochastic optimization","author":"kingma","year":"2014","journal-title":"arXiv 1412 6980"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/10287007\/10239221.pdf?arnumber=10239221","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,11,6]],"date-time":"2023-11-06T20:05:00Z","timestamp":1699301100000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10239221\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,11]]},"references-count":60,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2023.3307792","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,11]]}}}