{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,19]],"date-time":"2026-02-19T02:13:51Z","timestamp":1771467231668,"version":"3.50.1"},"reference-count":49,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100005230","name":"Chongqing Natural Science Foundation","doi-asserted-by":"publisher","award":["cstc2021jcyj-msxmX1090"],"award-info":[{"award-number":["cstc2021jcyj-msxmX1090"]}],"id":[{"id":"10.13039\/501100005230","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2024,2]]},"DOI":"10.1109\/tvlsi.2023.3321772","type":"journal-article","created":{"date-parts":[[2023,11,30]],"date-time":"2023-11-30T19:34:09Z","timestamp":1701372849000},"page":"382-395","source":"Crossref","is-referenced-by-count":12,"title":["High-Performance ECC Scalar Multiplication Architecture Based on Comb Method and Low-Latency Window Recoding Algorithm"],"prefix":"10.1109","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4140-7029","authenticated-orcid":false,"given":"Jingqi","family":"Zhang","sequence":"first","affiliation":[{"name":"School of Integrated Circuits and Electronics, Beijing Institute of Technology (BIT), Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9195-1327","authenticated-orcid":false,"given":"Zhiming","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and Electronics, Beijing Institute of Technology (BIT), Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingzhi","family":"Ma","sequence":"additional","affiliation":[{"name":"UNISOC (Shanghai) Technology Company Ltd., Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5335-5396","authenticated-orcid":false,"given":"Rongkun","family":"Jiang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and Electronics, Beijing Institute of Technology (BIT), Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-3554-0510","authenticated-orcid":false,"given":"Hongshuo","family":"Li","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and Electronics, Beijing Institute of Technology (BIT), Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8950-9337","authenticated-orcid":false,"given":"Weijiang","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and Electronics, Beijing Institute of Technology (BIT), Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.46586\/tches.v2023.i2.358-380"},{"key":"ref2","volume-title":"PipeMSM: Hardware acceleration for multi-scalar multiplication","author":"Xavier","year":"2022"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1142\/S0218126619300034"},{"key":"ref4","volume-title":"Safecurves: Choosing Safe Curves for Elliptic-Curve Cryptography","author":"Bernstein","year":"2023"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/C-CODE.2017.7918952"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2018.07.005"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TENCON.2019.8929556"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2574620"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2903170"},{"key":"ref10","first-page":"595","article-title":"Multiplication of multidigit numbers on automata","volume":"145","author":"Karatsuba","year":"1963","journal-title":"Doklady Akad Nauk Sssr"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2009.2020088"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2198502"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3051282"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2453360"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2230410"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2186104"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2021.3060505"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2914247"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-65277-7_10"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2019.0041"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2014.2323062"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1142\/S021812661750178X"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1142\/S0218126620501790"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2012.2234916"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2785382"},{"key":"ref26","volume-title":"Recommended Elliptic Curves for Federal Government Use","year":"1999"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-45353-9_19"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-68697-5_9"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-48405-1_25"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3282781"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1007\/s11227-023-05428-4"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2801118"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-540-31979-5_8"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/11689522_2"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-36400-5_22"},{"key":"ref36","volume-title":"Guide to Elliptic Curve Cryptography","author":"Hankerson","year":"2006"},{"key":"ref37","volume-title":"Efficient comb elliptic curve multiplication methods resistant to power analysis","author":"Feng","year":"2005"},{"key":"ref38","volume-title":"A comb method to render ECC resistant against Side Channel Attacks","author":"Hedabou","year":"2004"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1016\/0890-5401(88)90024-7"},{"key":"ref40","doi-asserted-by":"crossref","first-page":"207","DOI":"10.1023\/A:1013860532636","article-title":"Itoh-Tsujii inversion in standard basis and its application in cryptography and codes","volume":"25","author":"Guajardo","year":"2002","journal-title":"Des., Codes Cryptogr."},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TrustCom.2014.23"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-36400-5_26"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/FPL.2015.7293951"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2015.2455992"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2018.5056"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2828319"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1145\/3310354"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3141104"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-48059-5_14"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/10411971\/10335624.pdf?arnumber=10335624","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,6,3]],"date-time":"2024-06-03T17:53:53Z","timestamp":1717437233000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10335624\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2]]},"references-count":49,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2023.3321772","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,2]]}}}