{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,3]],"date-time":"2026-08-03T04:37:25Z","timestamp":1785731845731,"version":"3.56.0"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of the Korea","doi-asserted-by":"publisher","award":["RS-2023-00281582"],"award-info":[{"award-number":["RS-2023-00281582"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100004358","name":"Samsung Electronics","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2023,12]]},"DOI":"10.1109\/tvlsi.2023.3322709","type":"journal-article","created":{"date-parts":[[2023,10,13]],"date-time":"2023-10-13T14:20:34Z","timestamp":1697206834000},"page":"2152-2156","source":"Crossref","is-referenced-by-count":5,"title":["A Temperature Compensated Ring Oscillator With <i>LC<\/i>-Based Period Error Detection"],"prefix":"10.1109","volume":"31","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2122-1481","authenticated-orcid":false,"given":"Seongun","family":"Bae","sequence":"first","affiliation":[{"name":"Department of Electronic and Electrical Engineering, Pohang University of Science and Technology, Pohang, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Minseob","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwasung, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sang-Min","family":"Yoo","sequence":"additional","affiliation":[{"name":"Department of Electronic and Electrical Engineering, Pohang University of Science and Technology, Pohang, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1814-6211","authenticated-orcid":false,"given":"Jae-Yoon","family":"Sim","sequence":"additional","affiliation":[{"name":"Department of Electronic and Electrical Engineering, Pohang University of Science and Technology, Pohang, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062942"},{"key":"ref2","first-page":"60","article-title":"A 0.01 mm2 10 MHz RC frequency reference with a 1-point on-chip-trimmed inaccuracy of \u00b10.28% from \u221245\u00b0C to 125\u00b0C in 0.18\u03bcm CMOS","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"An"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067729"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2023.3277617"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3142662"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3135939"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365795"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3090682"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2748130"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2009.2016133"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2280052"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2936352"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2015.7313848"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2544755"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2067930"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2557807"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2817602"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.883337"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS.2018.8551126"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3183208"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/10328903\/10284912.pdf?arnumber=10284912","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,20]],"date-time":"2025-10-20T17:59:50Z","timestamp":1760983190000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10284912\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12]]},"references-count":20,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2023.3322709","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,12]]}}}