{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,30]],"date-time":"2026-04-30T16:56:43Z","timestamp":1777568203022,"version":"3.51.4"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U2167208"],"award-info":[{"award-number":["U2167208"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"\u201cPioneer\u201d and \u201cLeading Goos\u201d Research and Development Program of Zhejiang"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2024,2]]},"DOI":"10.1109\/tvlsi.2023.3332010","type":"journal-article","created":{"date-parts":[[2023,12,28]],"date-time":"2023-12-28T20:05:52Z","timestamp":1703793952000},"page":"372-381","source":"Crossref","is-referenced-by-count":8,"title":["Improving Radiation Reliability of SRAM-Based Physical Unclonable Function With Self-Healing and Pre-Irradiation Masking Techniques"],"prefix":"10.1109","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0431-8852","authenticated-orcid":false,"given":"Zhuojun","family":"Chen","sequence":"first","affiliation":[{"name":"Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, China"}]},{"given":"Wenhao","family":"Yang","sequence":"additional","affiliation":[{"name":"Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, China"}]},{"given":"Jinghang","family":"Chen","sequence":"additional","affiliation":[{"name":"Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2502-9550","authenticated-orcid":false,"given":"Zujun","family":"Wang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Intense Pulsed Radiation Simulation and Effect, Northwest Institute of Nuclear Technology, Xi’an, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9865-5077","authenticated-orcid":false,"given":"Ding","family":"Ding","sequence":"additional","affiliation":[{"name":"School of Intelligent Engineering and Intelligent Manufacturing, Hunan University of Technology and Business, Changsha, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TNSM.2023.3246732"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCCN.2019.2926707"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2022.3194948"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.comnet.2022.109246"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2023.3236625"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2865584"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3050959"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2938133"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2927758"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365741"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2020.3034266"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3035207"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2963002"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2018.2879216"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3233373"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2021.3126587"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2019.8780246"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/SmartIoT52359.2021.00043"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063075"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310219"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2022.3146279"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2021.3087106"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662537"},{"key":"ref24","first-page":"1","article-title":"The effects of space environments on electronic components","volume":"1","author":"Petkov","year":"2003","journal-title":"NASA Jet Propulsion Lab. Open Repository"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/10411971\/10375959.pdf?arnumber=10375959","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,6,3]],"date-time":"2024-06-03T17:54:14Z","timestamp":1717437254000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10375959\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2]]},"references-count":24,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2023.3332010","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,2]]}}}