{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,20]],"date-time":"2026-02-20T18:45:30Z","timestamp":1771613130835,"version":"3.50.1"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2018YFB1304700"],"award-info":[{"award-number":["2018YFB1304700"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2024,3]]},"DOI":"10.1109\/tvlsi.2024.3350870","type":"journal-article","created":{"date-parts":[[2024,1,16]],"date-time":"2024-01-16T18:29:06Z","timestamp":1705429746000},"page":"422-431","source":"Crossref","is-referenced-by-count":10,"title":["A CMOS AFE Array With DC Input Current Cancellation for FMCW LiDAR"],"prefix":"10.1109","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7475-2331","authenticated-orcid":false,"given":"Xiaoxiao","family":"Zheng","sequence":"first","affiliation":[{"name":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology and the Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3150-6779","authenticated-orcid":false,"given":"Mao","family":"Ye","sequence":"additional","affiliation":[{"name":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology and the Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-6390-1883","authenticated-orcid":false,"given":"Zhiwei","family":"Li","sequence":"additional","affiliation":[{"name":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology and the Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7014-8145","authenticated-orcid":false,"given":"Yao","family":"Li","sequence":"additional","affiliation":[{"name":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology and the Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5970-6639","authenticated-orcid":false,"given":"Qiuwei","family":"Wang","sequence":"additional","affiliation":[{"name":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology and the Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin, China"}]},{"given":"Yiqiang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology and the Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.3043797"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3204639"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2824766"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2215800"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3022658"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MSP.2020.2973615"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3181133"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2619762"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2955671"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2327282"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1117\/1.oe.56.3.031224"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2021.3062637"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2016.7417983"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICoOM.2012.6316251"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2724064"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICTA56932.2022.9963043"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2621755"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1364\/OE.438453"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2003.820454"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2868315"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2809795"},{"key":"ref22","volume-title":"LMH32404 Four-Channel, Differential Output, Multiplexed Transimpedance Amplifier With Integrated Clamping and Ambient Light Cancellation","year":"2022"},{"key":"ref23","volume-title":"Noise in Solid State Devices and Circuits","author":"Ziel","year":"1986"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2012.2225141"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.827807"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/4.568846"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2021.3049410"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2852794"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3236678"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/10445387\/10400997.pdf?arnumber=10400997","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,3]],"date-time":"2024-03-03T07:38:28Z","timestamp":1709451508000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10400997\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,3]]},"references-count":29,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3350870","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,3]]}}}