{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T15:55:14Z","timestamp":1780674914911,"version":"3.54.1"},"reference-count":10,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T00:00:00Z","timestamp":1727740800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T00:00:00Z","timestamp":1727740800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,1]],"date-time":"2024-10-01T00:00:00Z","timestamp":1727740800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003606","name":"Korean Government","doi-asserted-by":"publisher","award":["2022R1A2B5B03002504"],"award-info":[{"award-number":["2022R1A2B5B03002504"]}],"id":[{"id":"10.13039\/501100003606","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2024,10]]},"DOI":"10.1109\/tvlsi.2024.3421563","type":"journal-article","created":{"date-parts":[[2024,7,8]],"date-time":"2024-07-08T17:56:33Z","timestamp":1720461393000},"page":"1950-1954","source":"Crossref","is-referenced-by-count":11,"title":["An Area-Efficient Systolic Array Redundancy Architecture for Reliable AI Accelerator"],"prefix":"10.1109","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6868-0829","authenticated-orcid":false,"given":"Hayoung","family":"Lee","sequence":"first","affiliation":[{"name":"Department of Intelligence Semiconductor Engineering, Ajou University, Suwon-si, Gyeonggi-do, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3718-4352","authenticated-orcid":false,"given":"Jongho","family":"Park","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7093-2095","authenticated-orcid":false,"given":"Sungho","family":"Kang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.eng.2020.01.007"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2019.2915656"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.48550\/ARXIV.1906.00091"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/AO.59.000817"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS50870.2020.9159704"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/12.21144"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/electronics9020338"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3051841"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2023.3236875"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10695156\/10587312.pdf?arnumber=10587312","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,27]],"date-time":"2024-09-27T04:36:48Z","timestamp":1727411808000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10587312\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10]]},"references-count":10,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3421563","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,10]]}}}