{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T16:40:41Z","timestamp":1772642441001,"version":"3.50.1"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2024,11]]},"DOI":"10.1109\/tvlsi.2024.3421625","type":"journal-article","created":{"date-parts":[[2024,7,25]],"date-time":"2024-07-25T17:39:50Z","timestamp":1721929190000},"page":"2144-2148","source":"Crossref","is-referenced-by-count":3,"title":["Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures"],"prefix":"10.1109","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2883-2768","authenticated-orcid":false,"given":"Leandro M.","family":"Giacomini Rocha","sequence":"first","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-9031-2735","authenticated-orcid":false,"given":"Refik","family":"Bilgic","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-8202-2159","authenticated-orcid":false,"given":"Mohamed","family":"Naeim","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-2998-9827","authenticated-orcid":false,"given":"Sudipta","family":"Das","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0680-4969","authenticated-orcid":false,"given":"Herman","family":"Oprins","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Amirreza","family":"Yousefzadeh","sequence":"additional","affiliation":[{"name":"University of Twente, Enschede, The Netherlands"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8016-0888","authenticated-orcid":false,"given":"Mario","family":"Konijnenburg","sequence":"additional","affiliation":[{"name":"imec-NL, Eindhoven, The Netherlands"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5915-5160","authenticated-orcid":false,"given":"Dragomir","family":"Milojevic","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-2558-7504","authenticated-orcid":false,"given":"James","family":"Myers","sequence":"additional","affiliation":[{"name":"imec-UK, Cambridge, U.K."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Julien","family":"Ryckaert","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7912-3692","authenticated-orcid":false,"given":"Dwaipayan","family":"Biswas","sequence":"additional","affiliation":[{"name":"imec VZW, Leuven, Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3389\/fnins.2023.1074439"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3389\/fnins.2023.1187252"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-019-1424-8"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2015.2444094"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2022.3166331"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371905"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2022.3218057"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC57175.2023.10155075"},{"key":"ref9","volume-title":"IMEC Highlights Benefits of 3D-SOC Design and Backside Interconnects for Future High-Performance Systems","author":"Milojevic","year":"2021"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC48104.2019.9058901"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2023.3314135"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654245"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ectc51529.2024.00171"},{"key":"ref14","first-page":"453","article-title":"Physical design level PPA evaluation of buried power rail at 2 nm node","volume-title":"Proc. SPIE","volume":"12495","author":"Sisto"},{"key":"ref15","volume-title":"Cadence\u00ae ledR Integrity\u2122 3D-IC Platform","year":"2023"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED52811.2021.9502481"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10736447\/10609345.pdf?arnumber=10609345","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T00:01:51Z","timestamp":1732665711000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10609345\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11]]},"references-count":16,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3421625","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,11]]}}}