{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,2]],"date-time":"2026-01-02T07:38:10Z","timestamp":1767339490039,"version":"3.37.3"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100010877","name":"Science, Technology and Innovation Commission of Shenzhen unicipality","doi-asserted-by":"publisher","award":["JCYJ20180508161601937"],"award-info":[{"award-number":["JCYJ20180508161601937"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2024,11]]},"DOI":"10.1109\/tvlsi.2024.3449293","type":"journal-article","created":{"date-parts":[[2024,9,9]],"date-time":"2024-09-09T18:08:03Z","timestamp":1725905283000},"page":"2001-2011","source":"Crossref","is-referenced-by-count":4,"title":["A Two-Channel Interleaved ADC With Fast-Converging Foreground Time Calibration and Comparison-Based Control Logic"],"prefix":"10.1109","volume":"32","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-4344-2413","authenticated-orcid":false,"given":"Xiang","family":"Yan","sequence":"first","affiliation":[{"name":"Institute of Photo Electronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3085-2242","authenticated-orcid":false,"given":"Kefan","family":"Qin","sequence":"additional","affiliation":[{"name":"Institute of Photo Electronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]},{"given":"Xinyue","family":"Zheng","sequence":"additional","affiliation":[{"name":"Institute of Photo Electronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3991-7575","authenticated-orcid":false,"given":"Weibo","family":"Hu","sequence":"additional","affiliation":[{"name":"Institute of Photo Electronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5242-4305","authenticated-orcid":false,"given":"Wei","family":"Ma","sequence":"additional","affiliation":[{"name":"Institute of Photo Electronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8235-2365","authenticated-orcid":false,"given":"Haitao","family":"Cui","sequence":"additional","affiliation":[{"name":"Institute of Photo Electronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2164961"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2007.896056"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2413850"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3392611"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2021.3117941"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3182217"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3114708"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3184010"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2239005"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757481"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7063127"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2016.7573536"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/81.915383"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2009.4977318"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2843360"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2013.6658420"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357058"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2661481"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960476"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/82.850419"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7418110"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2014.6865649"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2109511"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373495"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401263"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2728784"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2017.7993700"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2732732"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2975304"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3051612"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3163431"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3229208"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10736447\/10669386.pdf?arnumber=10669386","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T03:08:01Z","timestamp":1732676881000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10669386\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11]]},"references-count":32,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3449293","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2024,11]]}}}