{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T10:55:07Z","timestamp":1785581707447,"version":"3.56.0"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2023YFF0616600"],"award-info":[{"award-number":["2023YFF0616600"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U23A20291"],"award-info":[{"award-number":["U23A20291"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62021004"],"award-info":[{"award-number":["62021004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62404171"],"award-info":[{"award-number":["62404171"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,3]]},"DOI":"10.1109\/tvlsi.2024.3478846","type":"journal-article","created":{"date-parts":[[2024,10,25]],"date-time":"2024-10-25T17:32:34Z","timestamp":1729877554000},"page":"627-637","source":"Crossref","is-referenced-by-count":9,"title":["Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3156-0564","authenticated-orcid":false,"given":"Changle","family":"Zhi","sequence":"first","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6557-2286","authenticated-orcid":false,"given":"Gang","family":"Dong","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0316-3474","authenticated-orcid":false,"given":"Deguang","family":"Yang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daihang","family":"Liu","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-0648-153X","authenticated-orcid":false,"given":"Yinghao","family":"Feng","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6882-4637","authenticated-orcid":false,"given":"Yang","family":"Wang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7764-1928","authenticated-orcid":false,"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2022.3169953"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2960207"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063103"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2017.341"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/asp-dac52403.2022.9712482"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/iTherm54085.2022.9899583"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2024.3374231"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2023.3239011"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3174608"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2023.120609"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/SaPIW.2016.7496276"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474011"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.2970019"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2611009"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2019.2921008"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2019.8824797"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2693243"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3015494"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3113664"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3163673"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2657382"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3430498"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101890"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2010.2043673"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897341"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2010.5711316"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2019.8825309"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2015.7383675"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2020.3024223"},{"key":"ref30","doi-asserted-by":"crossref","first-page":"7","DOI":"10.1007\/978-94-015-7744-1_2","article-title":"Simulated annealing","volume-title":"Simulated Annealing: Theory and Applications","author":"van Laarhoven","year":"1987"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2214482"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2276050"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00231"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371983"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1088\/1748-0221\/9\/01\/C01005"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10903148\/10735253.pdf?arnumber=10735253","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,26]],"date-time":"2025-02-26T05:42:53Z","timestamp":1740548573000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10735253\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3]]},"references-count":35,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3478846","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,3]]}}}