{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T15:18:13Z","timestamp":1759331893115,"version":"3.38.0"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,3]]},"DOI":"10.1109\/tvlsi.2024.3479068","type":"journal-article","created":{"date-parts":[[2024,11,11]],"date-time":"2024-11-11T18:48:30Z","timestamp":1731350910000},"page":"841-852","source":"Crossref","is-referenced-by-count":2,"title":["Cost-Effective Analytical Models of Resistive Opens Defects in FinFET Technology"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-0685-7630","authenticated-orcid":false,"given":"Gustavo","family":"Aguirre","sequence":"first","affiliation":[{"name":"National Institute of Astrophysics, Optics and Electronics (INAOE), Puebla, Mexico"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9939-0974","authenticated-orcid":false,"given":"Freddy","family":"Forero","sequence":"additional","affiliation":[{"name":"National Institute of Astrophysics, Optics and Electronics (INAOE), Puebla, Mexico"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4440-3800","authenticated-orcid":false,"given":"Victor","family":"Champac","sequence":"additional","affiliation":[{"name":"National Institute of Astrophysics, Optics and Electronics (INAOE), Puebla, Mexico"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michel","family":"Renovell","sequence":"additional","affiliation":[{"name":"Laboratory of Informatics, Robotics and Microelectronics of Montpellier (LIRMM), Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6458-5018","authenticated-orcid":false,"given":"Florence","family":"Azais","sequence":"additional","affiliation":[{"name":"Laboratory of Informatics, Robotics and Microelectronics of Montpellier (LIRMM), Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8575-7114","authenticated-orcid":false,"given":"Mariane","family":"Comte","sequence":"additional","affiliation":[{"name":"Laboratory of Informatics, Robotics and Microelectronics of Montpellier (LIRMM), Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8753-3392","authenticated-orcid":false,"given":"Jean-Marc","family":"Galliere","sequence":"additional","affiliation":[{"name":"Laboratory of Informatics, Robotics and Microelectronics of Montpellier (LIRMM), Montpellier, France"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2005.881001"},{"key":"ref2","article-title":"New approaches to improving quality and accelerating yield ramp for finfet technology","author":"Sawicki","year":"2013","journal-title":"Semicon West"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2011.2169807"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2012.6401565"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2918768"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3001259"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3564244"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LATS53581.2021.9651857"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VTEST.2003.1197678"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2008.19"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2013.23"},{"key":"ref12","first-page":"1","article-title":"Ensuring functional safety with advanced fault simulation","volume-title":"Proc. Synopsys","author":"Chugh"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1999.805769"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1631\/jzus.C1100242"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2008.05.034"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2010.5551437"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2002.1033788"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2008.11.001"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2011.51"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2014.7046976"},{"year":"2018","key":"ref21","article-title":"BSIM-CMG model, BSIM-CMG 110.0.0"},{"volume-title":"14nm PTM-MG Bulk Model","year":"2018","key":"ref22"},{"key":"ref23","volume":"2","author":"Giancoli","year":"2008","journal-title":"Physics for Scientists & Engineers With Modern Physics"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1119\/1.2342517"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT51558.2021.9626531"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.4324\/9781003002314"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2009.57"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2513379"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10903148\/10750047.pdf?arnumber=10750047","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,26]],"date-time":"2025-02-26T05:47:08Z","timestamp":1740548828000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10750047\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3]]},"references-count":28,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3479068","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2025,3]]}}}