{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T20:11:27Z","timestamp":1778789487762,"version":"3.51.4"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2022YFB4401302"],"award-info":[{"award-number":["2022YFB4401302"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174124"],"award-info":[{"award-number":["62174124"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62021004"],"award-info":[{"award-number":["62021004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,4]]},"DOI":"10.1109\/tvlsi.2024.3487983","type":"journal-article","created":{"date-parts":[[2024,11,5]],"date-time":"2024-11-05T13:39:00Z","timestamp":1730813940000},"page":"1167-1171","source":"Crossref","is-referenced-by-count":4,"title":["Compact On-Chip Half-Mode SIW-Based Dual-Band Bandpass Filter Using 3-D Stacked Inductors With Controllable Transmission Zero"],"prefix":"10.1109","volume":"33","author":[{"given":"Nuo","family":"Liu","sequence":"first","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Microelectronics, Xidian University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1798-7572","authenticated-orcid":false,"given":"Xiaoxian","family":"Liu","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Microelectronics, Xidian University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6033-5740","authenticated-orcid":false,"given":"Lei","family":"Zhang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Microelectronics, Xidian University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chenhui","family":"Fan","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Microelectronics, Xidian University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7764-1928","authenticated-orcid":false,"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Microelectronics, Xidian University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3074061"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3253567"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3188273"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.2970730"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2021.3062862"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2931446"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2018.03.032"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3308212"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3236365"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3052574"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3111860"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3157713"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2020.3027734"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3166746"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2020.2974091"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2014.2342883"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3036385"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2568755"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10937162\/10744604.pdf?arnumber=10744604","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T20:01:31Z","timestamp":1778788891000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10744604\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4]]},"references-count":18,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3487983","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4]]}}}