{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,3]],"date-time":"2026-07-03T16:24:41Z","timestamp":1783095881216,"version":"3.54.6"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"NSF","award":["2043017"],"award-info":[{"award-number":["2043017"]}]},{"name":"Pitt Momentum Funds"},{"name":"University of Pittsburgh Center for Research Computing through the resources provided"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,5]]},"DOI":"10.1109\/tvlsi.2024.3508259","type":"journal-article","created":{"date-parts":[[2024,12,4]],"date-time":"2024-12-04T19:26:48Z","timestamp":1733340408000},"page":"1244-1254","source":"Crossref","is-referenced-by-count":8,"title":["A Picowatt CMOS Voltage Reference Using Independent TC and Output Level Calibrations"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1417-1420","authenticated-orcid":false,"given":"Yuyang","family":"Li","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ryan","family":"Caginalp","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5723-9678","authenticated-orcid":false,"given":"Inhee","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2014.6894411"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.23919\/vlsic.2019.8778007"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2825455"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502287"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2165235"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2206683"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2654326"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2017.8240267"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/iscas48785.2022.9937312"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/vlsicircuits18222.2020.9162872"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1017\/cbo9781139195065"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2012.6330628"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2004.1332709"},{"key":"ref14","volume-title":"Temperature Ranges","year":"2024"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2754644"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494332"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2654441"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2021.3058716"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2754442"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/92\/10977652\/10777853-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10977652\/10777853.pdf?arnumber=10777853","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,26]],"date-time":"2025-04-26T04:51:13Z","timestamp":1745643073000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10777853\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5]]},"references-count":19,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3508259","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,5]]}}}