{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,8]],"date-time":"2026-01-08T03:50:47Z","timestamp":1767844247202,"version":"3.49.0"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62071150"],"award-info":[{"award-number":["62071150"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,4]]},"DOI":"10.1109\/tvlsi.2024.3518554","type":"journal-article","created":{"date-parts":[[2024,12,27]],"date-time":"2024-12-27T19:42:14Z","timestamp":1735328534000},"page":"1145-1156","source":"Crossref","is-referenced-by-count":2,"title":["An MIV Fault Diagnosis Method Based on Signal Transmission Performance Analysis"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9594-6864","authenticated-orcid":false,"given":"Ziwen","family":"Xiao","sequence":"first","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lifu","family":"Du","sequence":"additional","affiliation":[{"name":"China Academy of Launch Vehicle Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8614-722X","authenticated-orcid":false,"given":"Zhiming","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3895-2352","authenticated-orcid":false,"given":"Cuiyu","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4669-934X","authenticated-orcid":false,"given":"Yang","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2768330"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2016.7519292"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2015.7342390"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2015.7112735"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3041026"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2017.43"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2015.7165915"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.6109\/jicce.2014.12.3.186"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203860"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2018.8617955"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2019.8758650"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2864290"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3357158"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2016.7835425"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2935410"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2015.7342389"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2019.00-22"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2788896"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2887051"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2016.7519330"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2019.8791515"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3228850"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2024.3385332"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2010.5702655"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2006.1638778"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10937162\/10816729.pdf?arnumber=10816729","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,24]],"date-time":"2025-03-24T19:16:31Z","timestamp":1742843791000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10816729\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4]]},"references-count":25,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3518554","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4]]}}}