{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,26]],"date-time":"2026-02-26T15:23:25Z","timestamp":1772119405863,"version":"3.50.1"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100010023","name":"Natural Science Foundation of the Higher Education Institutions of Anhui Province","doi-asserted-by":"publisher","award":["2023AH040011"],"award-info":[{"award-number":["2023AH040011"]}],"id":[{"id":"10.13039\/501100010023","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010023","name":"Natural Science Foundation of the Higher Education Institutions of Anhui Province","doi-asserted-by":"publisher","award":["2022AH050074"],"award-info":[{"award-number":["2022AH050074"]}],"id":[{"id":"10.13039\/501100010023","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62104001"],"award-info":[{"award-number":["62104001"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62274001"],"award-info":[{"award-number":["62274001"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013064","name":"Key Research and Development Program of Anhui Province","doi-asserted-by":"publisher","award":["2022a05020044"],"award-info":[{"award-number":["2022a05020044"]}],"id":[{"id":"10.13039\/501100013064","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,4]]},"DOI":"10.1109\/tvlsi.2024.3519748","type":"journal-article","created":{"date-parts":[[2024,12,27]],"date-time":"2024-12-27T19:42:14Z","timestamp":1735328534000},"page":"1073-1081","source":"Crossref","is-referenced-by-count":8,"title":["High-Reliability and High-Throughput CIM 10T-SRAM for Multiplication and Accumulation Operations With 274.3 GOPS and 200\u2013237.5 TOPS\/W"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6201-8589","authenticated-orcid":false,"given":"Wenjuan","family":"Lu","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-6822-7703","authenticated-orcid":false,"given":"Lubin","family":"Xiang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]},{"given":"Ling","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2408-5048","authenticated-orcid":false,"given":"Chunyu","family":"Peng","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]},{"given":"Chenghu","family":"Dai","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3314-1606","authenticated-orcid":false,"given":"Zhiting","family":"Lin","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5012-2570","authenticated-orcid":false,"given":"Xiulong","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3061260"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/nature14539"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2016.2642198"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2017.2767624"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2992886"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2907488"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3234620"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3092759"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952773"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062995"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365766"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3343669"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1126\/science.ade3483"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3159808"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3274703"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/10937162\/10816728.pdf?arnumber=10816728","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,24]],"date-time":"2025-03-24T19:16:18Z","timestamp":1742843778000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10816728\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4]]},"references-count":15,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2024.3519748","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4]]}}}