{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T05:26:37Z","timestamp":1772774797392,"version":"3.50.1"},"reference-count":11,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2025,6,1]],"date-time":"2025-06-01T00:00:00Z","timestamp":1748736000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,6,1]],"date-time":"2025-06-01T00:00:00Z","timestamp":1748736000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,6,1]],"date-time":"2025-06-01T00:00:00Z","timestamp":1748736000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,6]]},"DOI":"10.1109\/tvlsi.2025.3542096","type":"journal-article","created":{"date-parts":[[2025,2,25]],"date-time":"2025-02-25T18:58:38Z","timestamp":1740509918000},"page":"1784-1788","source":"Crossref","is-referenced-by-count":2,"title":["A 1 mW\u201310 W, Over 86.4% Efficiency Tri-Mode Buck Converter With Ripple-Based Control for Mobile Applications"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-9069-7121","authenticated-orcid":false,"given":"Shuyu","family":"Zhang","sequence":"first","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2500-2892","authenticated-orcid":false,"given":"Menglian","family":"Zhao","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8550-6320","authenticated-orcid":false,"given":"Shuang","family":"Song","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMC.2023.3268323"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3006200"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3144771"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/mwscas.2019.8885397"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3254906"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3071652"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2995734"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3090911"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3422382"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3320354"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/APEC42165.2021.9487365"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/11010805\/10902517.pdf?arnumber=10902517","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,23]],"date-time":"2025-05-23T04:27:47Z","timestamp":1747974467000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10902517\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,6]]},"references-count":11,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2025.3542096","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,6]]}}}