{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,2]],"date-time":"2025-07-02T04:05:42Z","timestamp":1751429142165,"version":"3.41.0"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174181"],"award-info":[{"award-number":["62174181"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2025,7]]},"DOI":"10.1109\/tvlsi.2025.3559669","type":"journal-article","created":{"date-parts":[[2025,4,28]],"date-time":"2025-04-28T17:36:04Z","timestamp":1745861764000},"page":"1838-1847","source":"Crossref","is-referenced-by-count":0,"title":["A 0.6-V 9.38-Bit 6.9-kS\/s Capacitor-Splitting Bypass Window SAR ADC for Wearable 12-Lead ECG Acquisition Systems"],"prefix":"10.1109","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0009-0007-3085-054X","authenticated-orcid":false,"given":"Kangkang","family":"Sun","sequence":"first","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5285-4997","authenticated-orcid":false,"given":"Jingjing","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-6963-2302","authenticated-orcid":false,"given":"Feng","family":"Yan","sequence":"additional","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6373-2685","authenticated-orcid":false,"given":"Yuan","family":"Ren","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam, Hong Kong"}]},{"given":"Ruihuang","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]},{"given":"Bingjun","family":"Xiong","sequence":"additional","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]},{"given":"Zhipeng","family":"Li","sequence":"additional","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]},{"given":"Jian","family":"Guan","sequence":"additional","affiliation":[{"name":"School of Electronics and Communication Engineering, Sun Yat-sen University, Shenzhen, China"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1161\/cir.0000000000001137"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1007\/s10484-008-9054-1"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/tvlsi.2023.3314611"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/jssc.2016.2605660"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/jssc.2014.2359962"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/jssc.2019.2903471"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/tbcas.2021.3084152"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/jssc.2008.2006462"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/tbcas.2022.3224387"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/tcsi.2018.2859837"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/vlsic.2015.7231327"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/jssc.2014.2352304"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/tcsii.2022.3181489"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/tvlsi.2022.3187659"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/tcsi.2020.2983743"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/jssc.2012.2217635"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/jssc.2018.2819164"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1109\/jssc.2012.2211696"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/tcsi.2016.2617879"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1109\/isscc42614.2022.9731546"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/tcsii.2023.3266605"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/tcsii.2025.3541236"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1109\/jssc.2010.2042254"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1109\/jssc.2010.2048498"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1109\/esscirc.2012.6341363"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1109\/tvlsi.2021.3128166"},{"doi-asserted-by":"publisher","key":"ref27","DOI":"10.1109\/tbcas.2024.3423366"},{"doi-asserted-by":"publisher","key":"ref28","DOI":"10.1109\/tcsi.2019.2922726"},{"doi-asserted-by":"publisher","key":"ref29","DOI":"10.1109\/JSEN.2019.2949641"},{"issue":"5","key":"ref30","doi-asserted-by":"crossref","first-page":"1716","DOI":"10.1109\/TCSI.2019.2899162","article-title":"A 10-bit 200-kS\/s 1.76-\u03bc w SAR ADC with hybrid CAP-MOS DAC for energy-limited applications","volume":"66","author":"Zhang","year":"2019","journal-title":"IEEE Trans. Circuits Syst. I, Reg. Papers"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/11060007\/10978047.pdf?arnumber=10978047","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T05:38:58Z","timestamp":1751348338000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10978047\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7]]},"references-count":30,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2025.3559669","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2025,7]]}}}