{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,27]],"date-time":"2026-08-27T05:19:01Z","timestamp":1787807941523,"version":"build-2784847793"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Excellent Researcher Support Project of Kwangwoon University in 2026"},{"name":"Institute of Information and Communications Technology Planning and Evaluation","award":["RS-2026-25508822"],"award-info":[{"award-number":["RS-2026-25508822"]}]},{"name":"National Research Foundation of Korea (NRF) Grant"},{"name":"Korean Government [Ministry of Science and ICT (MSIT)]","award":["RS-2024-00334247"],"award-info":[{"award-number":["RS-2024-00334247"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2026,9]]},"DOI":"10.1109\/tvlsi.2026.3705461","type":"journal-article","created":{"date-parts":[[2026,6,29]],"date-time":"2026-06-29T19:43:13Z","timestamp":1782762193000},"page":"2915-2923","source":"Crossref","is-referenced-by-count":0,"title":["7T SRAM Macro Supporting 2W\/2R Adjacent Dual-Row Access for Enhanced Memory Bandwidth and Energy Efficiency"],"prefix":"10.1109","volume":"34","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-6166-2495","authenticated-orcid":false,"given":"Ho-Sung","family":"Lee","sequence":"first","affiliation":[{"name":"Kwangwoon University","place":["Seoul, South Korea"],"department":["Department of Electronics and Communications Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ik-Hyeon","family":"Jeon","sequence":"additional","affiliation":[{"name":"Kwangwoon University","place":["Seoul, South Korea"],"department":["Department of Electronics and Communications Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiwon","family":"Lee","sequence":"additional","affiliation":[{"name":"Micron Technology Taiwan, Inc.,","place":["Taoyuan, Taiwan"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-0586-4272","authenticated-orcid":false,"given":"Eun-Bi","family":"Koh","sequence":"additional","affiliation":[{"name":"Kwangwoon University","place":["Seoul, South Korea"],"department":["Department of Electronics and Communications Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6354-5612","authenticated-orcid":false,"given":"Joo-Hyung","family":"Chae","sequence":"additional","affiliation":[{"name":"Kwangwoon University","place":["Seoul, South Korea"],"department":["Department of Electronics and Communications Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2019.2910232"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2032698"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/.2005.1469239"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2012.2228398"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5433815"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3103916"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2015.7063052"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2607219"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC59616.2023.10268725"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2701547"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2071690"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VDAT.2007.373203"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2100834"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3115970"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3102675"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3229828"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS60917.2024.10658903"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3206318"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3355944"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2025.3562568"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/92\/11667419\/11585724.pdf?arnumber=11585724","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,27]],"date-time":"2026-08-27T04:37:03Z","timestamp":1787805423000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11585724\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,9]]},"references-count":20,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2026.3705461","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,9]]}}}