{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T18:55:30Z","timestamp":1772909730442,"version":"3.50.1"},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2022M710534"],"award-info":[{"award-number":["2022M710534"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["CSTB2022NSCQ-MSX0327"],"award-info":[{"award-number":["CSTB2022NSCQ-MSX0327"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["cstc2021jcyj-msxmX0458"],"award-info":[{"award-number":["cstc2021jcyj-msxmX0458"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61901066"],"award-info":[{"award-number":["61901066"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62271092"],"award-info":[{"award-number":["62271092"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100019642","name":"State Key Laboratory of Integrated Services Networks","doi-asserted-by":"publisher","award":["ISN22-17"],"award-info":[{"award-number":["ISN22-17"]}],"id":[{"id":"10.13039\/501100019642","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Opening Fund of State Key Laboratory of Millimeter Waves","award":["K202228"],"award-info":[{"award-number":["K202228"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Veh. Technol."],"published-print":{"date-parts":[[2023,4]]},"DOI":"10.1109\/tvt.2022.3228794","type":"journal-article","created":{"date-parts":[[2022,12,13]],"date-time":"2022-12-13T19:40:12Z","timestamp":1670960412000},"page":"5485-5490","source":"Crossref","is-referenced-by-count":12,"title":["Ergodic Rate of Reconfigurable Intelligent Surface-Assisted Multigroup Multicast System"],"prefix":"10.1109","volume":"72","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2289-5621","authenticated-orcid":false,"given":"Zhengchuan","family":"Chen","sequence":"first","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Li","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3176-7290","authenticated-orcid":false,"given":"Zhong","family":"Tian","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7838-8947","authenticated-orcid":false,"given":"Min","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Optoelectronic Engineering, Chongqing University of Posts and Telecommunications, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6404-0947","authenticated-orcid":false,"given":"Yunjian","family":"Jia","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4250-7315","authenticated-orcid":false,"given":"Linglong","family":"Dai","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2977772"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MVT.2022.3157070"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2019.2936025"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2019.2922609"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2021.3072729"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LWC.2020.3021473"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LWC.2021.3082409"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2021.3070014"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/WCSP52459.2021.9613364"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2995435"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2020.3048782"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/WCL.2014.030514.140057"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2019.2957994"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2020.2990098"}],"container-title":["IEEE Transactions on Vehicular Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/25\/10104191\/09983534.pdf?arnumber=9983534","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T04:58:32Z","timestamp":1706763512000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9983534\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4]]},"references-count":14,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tvt.2022.3228794","relation":{},"ISSN":["0018-9545","1939-9359"],"issn-type":[{"value":"0018-9545","type":"print"},{"value":"1939-9359","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,4]]}}}