{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T21:34:40Z","timestamp":1771018480984,"version":"3.50.1"},"reference-count":22,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Veh. Technol."],"published-print":{"date-parts":[[2026,2]]},"DOI":"10.1109\/tvt.2025.3598134","type":"journal-article","created":{"date-parts":[[2025,8,13]],"date-time":"2025-08-13T17:34:18Z","timestamp":1755106458000},"page":"3401-3405","source":"Crossref","is-referenced-by-count":1,"title":["Active RIS Assisted 3D Positioning in Scattering Environments"],"prefix":"10.1109","volume":"75","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-2047-4900","authenticated-orcid":false,"given":"Jian","family":"Sun","sequence":"first","affiliation":[{"name":"National Key Laboratory of Radar Signal Processing, Xidian University, Xi'an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9637-8088","authenticated-orcid":false,"given":"Minglei","family":"Yang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Radar Signal Processing, Xidian University, Xi'an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3907-386X","authenticated-orcid":false,"given":"Meng","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Electronic and Electrical Engineering, Henan Normal University, Xinxiang, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6389-8941","authenticated-orcid":false,"given":"Yuanwei","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2022.3195671"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2022.3173747"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICC42927.2021.9500281"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LSP.2022.3181783"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2021.3135275"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2021.3128415"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LWC.2023.3311730"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2023.3279621"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2020.3021338"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2022.3231893"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2023.3289066"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/PIMRC50174.2021.9569465"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2020.2987039"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2023.3245297"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2017.2723868"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2021.3109431"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/35.956124"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2022.3215253"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TGRS.2015.2506822"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VTC2020-Spring48590.2020.9129075"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/SPAWC51304.2022.9833921"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/7.937465"}],"container-title":["IEEE Transactions on Vehicular Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/25\/11395176\/11123162.pdf?arnumber=11123162","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T20:50:36Z","timestamp":1771015836000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11123162\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,2]]},"references-count":22,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tvt.2025.3598134","relation":{},"ISSN":["0018-9545","1939-9359"],"issn-type":[{"value":"0018-9545","type":"print"},{"value":"1939-9359","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,2]]}}}