{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T16:50:13Z","timestamp":1725727813253},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,12]],"date-time":"2023-10-12T00:00:00Z","timestamp":1697068800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,12]],"date-time":"2023-10-12T00:00:00Z","timestamp":1697068800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,12]]},"DOI":"10.1109\/uemcon59035.2023.10316081","type":"proceedings-article","created":{"date-parts":[[2023,11,17]],"date-time":"2023-11-17T18:54:18Z","timestamp":1700247258000},"page":"0793-0798","source":"Crossref","is-referenced-by-count":0,"title":["Modular Design Architecture of a HPEC System"],"prefix":"10.1109","author":[{"given":"Vikram","family":"Rajan","sequence":"first","affiliation":[{"name":"Product Development and Innovation Centre Bharat Electronics Limited,Bangalore,India"}]},{"given":"Nihar","family":"Ranjan","sequence":"additional","affiliation":[{"name":"Product Development and Innovation Centre Bharat Electronics Limited,Bangalore,India"}]},{"given":"Amgothu Murali","family":"Krishna","sequence":"additional","affiliation":[{"name":"Product Development and Innovation Centre Bharat Electronics Limited,Bangalore,India"}]},{"given":"N J","family":"Sandesh","sequence":"additional","affiliation":[{"name":"Product Development and Innovation Centre Bharat Electronics Limited,Bangalore,India"}]}],"member":"263","reference":[{"volume-title":"The Printed Circuit Designer\u2019s Guide to Signal Integrity by Example, Fadi Deek","key":"ref1"},{"volume-title":"The Printed Circuit Designer\u2019s Guide to Power Integrity by Example, Fadi Deek","key":"ref2"},{"volume-title":"EGX-MXM-A4500 User manual","key":"ref3"},{"volume-title":"Xeon_Dxxx_series_Design_for_Reliability_Guide_rev1_0, Intel","key":"ref4"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/incemic.2018.8704606"}],"event":{"name":"2023 IEEE 14th Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON)","start":{"date-parts":[[2023,10,12]]},"location":"New York, NY, USA","end":{"date-parts":[[2023,10,14]]}},"container-title":["2023 IEEE 14th Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10315953\/10315721\/10316081.pdf?arnumber=10316081","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T18:11:58Z","timestamp":1709403118000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10316081\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,12]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/uemcon59035.2023.10316081","relation":{},"subject":[],"published":{"date-parts":[[2023,10,12]]}}}