{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,14]],"date-time":"2025-07-14T02:37:47Z","timestamp":1752460667491},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,5]],"date-time":"2020-10-05T00:00:00Z","timestamp":1601856000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,5]],"date-time":"2020-10-05T00:00:00Z","timestamp":1601856000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10,5]]},"DOI":"10.1109\/vlsi-soc46417.2020.9344084","type":"proceedings-article","created":{"date-parts":[[2022,7,1]],"date-time":"2022-07-01T19:36:43Z","timestamp":1656704203000},"page":"52-57","source":"Crossref","is-referenced-by-count":1,"title":["A 0.8V 875 MS\/s 7b low-power SAR ADC for ADC-Based Wireline Receivers in 22nm FDSOI"],"prefix":"10.1109","author":[{"given":"David","family":"Cordova","sequence":"first","affiliation":[{"name":"MACOM Technologies Solutions,Sophia Antipolis,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wim","family":"Cops","sequence":"additional","affiliation":[{"name":"MACOM Technologies Solutions,Sophia Antipolis,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yann","family":"Deval","sequence":"additional","affiliation":[{"name":"IMS Lab, Univ. Bordeaux, Bordeaux INP,Talence,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Francois","family":"Rivet","sequence":"additional","affiliation":[{"name":"IMS Lab, Univ. Bordeaux, Bordeaux INP,Talence,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Herve","family":"Lapuyade","sequence":"additional","affiliation":[{"name":"IMS Lab, Univ. Bordeaux, Bordeaux INP,Talence,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nicolas","family":"Nodenot","sequence":"additional","affiliation":[{"name":"MACOM Technologies Solutions,Sophia Antipolis,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yohan","family":"Piccin","sequence":"additional","affiliation":[{"name":"MACOM Technologies Solutions,Sophia Antipolis,France"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2019.05.004"},{"key":"ref11","first-page":"1997","author":"murmann","year":"0","journal-title":"ADC Performance Survey"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2822823"},{"key":"ref13","first-page":"188","article-title":"A 0.024mm2 8b 400MS\/s SAR ADC with 2b\/cycle and resistive DAC in 65nm CMOS","author":"wei","year":"0","journal-title":"2011 IEEE International Solid-State Circuits Conference"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7418106"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2016.7838029"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS46596.2019.8964972"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2519397"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2013.6573564"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2042254"},{"key":"ref8","first-page":"642","article-title":"A power-efficient capacitor structure for highspeed charge recycling SAR ADCs","author":"yan","year":"0","journal-title":"2008 15th IEEE International Conference on Electronics, Circuits and Systems"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2279571"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2884352"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502436"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2909032"}],"event":{"name":"2020 IFIP\/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)","start":{"date-parts":[[2020,10,5]]},"location":"Salt Lake City, UT, USA","end":{"date-parts":[[2020,10,7]]}},"container-title":["2020 IFIP\/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9344049\/9344068\/09344084.pdf?arnumber=9344084","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,6]],"date-time":"2022-12-06T23:03:04Z","timestamp":1670367784000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9344084\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10,5]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/vlsi-soc46417.2020.9344084","relation":{},"subject":[],"published":{"date-parts":[[2020,10,5]]}}}