{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T15:43:46Z","timestamp":1730303026186,"version":"3.28.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,5]],"date-time":"2020-10-05T00:00:00Z","timestamp":1601856000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,5]],"date-time":"2020-10-05T00:00:00Z","timestamp":1601856000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10,5]]},"DOI":"10.1109\/vlsi-soc46417.2020.9344105","type":"proceedings-article","created":{"date-parts":[[2022,7,1]],"date-time":"2022-07-01T15:36:43Z","timestamp":1656689803000},"page":"186-191","source":"Crossref","is-referenced-by-count":0,"title":["Subthreshold-Hybrid Solutions for Thermal Sensor and Reference Circuits in Advanced CMOS"],"prefix":"10.1109","author":[{"given":"Matthias","family":"Eberlein","sequence":"first","affiliation":[{"name":"Institute for Integrated Circuits (IIC), Johannes Kepler University,Linz 4040,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Harald","family":"Pretl","sequence":"additional","affiliation":[{"name":"Institute for Integrated Circuits (IIC), Johannes Kepler University,Linz 4040,Austria"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1049\/el.2018.0555"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1977.1050882"},{"journal-title":"Temperature Sensor Performance Survey","year":"0","author":"makinwa","key":"ref12"},{"key":"ref13","doi-asserted-by":"crossref","first-page":"141","DOI":"10.1007\/s10470-009-9352-4","article-title":"Sub 1V CMOS bandgap reference design techniques: a survey","volume":"62","author":"fayomi","year":"2010","journal-title":"Analog Integrated Circuits and Signal Processing"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177053"},{"key":"ref3","first-page":"306","article-title":"A 0.7V, 2.35% 3?-Accuracy Bandgap Reference in 12nm CMOS","author":"chen","year":"2019","journal-title":"IEEE ISSCC Dig Tech Papers USA"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2921889"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1979.1051234"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310312"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494268"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2006.876377"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/4.760378"},{"key":"ref9","first-page":"224","article-title":"12.8 A BJT-based CMOS temperature sensor with a 3.6pJ·K2-resolution FoM","author":"heidary","year":"2014","journal-title":"Dig ISSCC"}],"event":{"name":"2020 IFIP\/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)","start":{"date-parts":[[2020,10,5]]},"location":"Salt Lake City, UT, USA","end":{"date-parts":[[2020,10,7]]}},"container-title":["2020 IFIP\/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9344049\/9344068\/09344105.pdf?arnumber=9344105","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,6]],"date-time":"2022-12-06T18:03:41Z","timestamp":1670349821000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9344105\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10,5]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/vlsi-soc46417.2020.9344105","relation":{},"subject":[],"published":{"date-parts":[[2020,10,5]]}}}