{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T16:33:01Z","timestamp":1725726781726},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,16]],"date-time":"2023-10-16T00:00:00Z","timestamp":1697414400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,16]],"date-time":"2023-10-16T00:00:00Z","timestamp":1697414400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,16]]},"DOI":"10.1109\/vlsi-soc57769.2023.10321888","type":"proceedings-article","created":{"date-parts":[[2023,11,22]],"date-time":"2023-11-22T19:06:55Z","timestamp":1700680015000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Soft Error Immune with Enhanced Critical Charge SIC14T SRAM Cell for Avionics Applications"],"prefix":"10.1109","author":[{"given":"Sagheer","family":"Ahmed","sequence":"first","affiliation":[{"name":"Indian Institute of Technology Jammu,IC-ResQ Lab,Department of Electrical Engineering,J&K,India,181221"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jayesh","family":"Ambulkar","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Jammu,IC-ResQ Lab,Department of Electrical Engineering,J&K,India,181221"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Debabrata","family":"Mondal","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Jammu,IC-ResQ Lab,Department of Electrical Engineering,J&K,India,181221"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ambika Prasad","family":"Shah","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Jammu,IC-ResQ Lab,Department of Electrical Engineering,J&K,India,181221"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3061642"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/DevIC50843.2021.9455796"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2952397"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/SILCON55242.2022.10028951"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-020-05864-7"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2304658"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2879341"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3064870"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICEE56203.2022.10117893"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2021.3049215"}],"event":{"name":"2023 IFIP\/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC)","start":{"date-parts":[[2023,10,16]]},"location":"Dubai, United Arab Emirates","end":{"date-parts":[[2023,10,18]]}},"container-title":["2023 IFIP\/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10321814\/10321836\/10321888.pdf?arnumber=10321888","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T21:05:54Z","timestamp":1709413554000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10321888\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,16]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/vlsi-soc57769.2023.10321888","relation":{},"subject":[],"published":{"date-parts":[[2023,10,16]]}}}