{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,29]],"date-time":"2025-12-29T19:05:26Z","timestamp":1767035126507},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,16]],"date-time":"2023-10-16T00:00:00Z","timestamp":1697414400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,16]],"date-time":"2023-10-16T00:00:00Z","timestamp":1697414400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,16]]},"DOI":"10.1109\/vlsi-soc57769.2023.10321899","type":"proceedings-article","created":{"date-parts":[[2023,11,22]],"date-time":"2023-11-22T19:06:55Z","timestamp":1700680015000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Gain Enhancement of Antenna-on-Chip at 94 GHz with an Integrated Artificial Magnetic Conductor for 6G System-on-Chip"],"prefix":"10.1109","author":[{"given":"Yiyang","family":"Yu","sequence":"first","affiliation":[{"name":"King Abdullah University of Science and Technology,Electrical and Computer Engineering Program,Thuwal,Saudi Arabia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Atif","family":"Shamim","sequence":"additional","affiliation":[{"name":"King Abdullah University of Science and Technology,Electrical and Computer Engineering Program,Thuwal,Saudi Arabia"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"volume-title":"Antenna-on-Chip: Design, Challenges, and Opportunities.","year":"2021","author":"Cheema","key":"ref1"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/mmm.2012.2226542"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/lawp.2019.2927300"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2006.884811"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2011.2161600"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2020.2975276"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/lawp.2021.3054555"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2016.2623948"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/aps.2006.1711487"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2015.2490248"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/lawp.2022.3186917"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2012.2189725"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2019.2957713"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/lawp.2019.2908891"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/lawp.2017.2749308"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2022.3140528"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2023.3239102"}],"event":{"name":"2023 IFIP\/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC)","start":{"date-parts":[[2023,10,16]]},"location":"Dubai, United Arab Emirates","end":{"date-parts":[[2023,10,18]]}},"container-title":["2023 IFIP\/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10321814\/10321836\/10321899.pdf?arnumber=10321899","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T21:06:13Z","timestamp":1709413573000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10321899\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,16]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/vlsi-soc57769.2023.10321899","relation":{},"subject":[],"published":{"date-parts":[[2023,10,16]]}}}