{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T15:21:28Z","timestamp":1759332088244,"version":"3.32.0"},"reference-count":22,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,6]],"date-time":"2024-10-06T00:00:00Z","timestamp":1728172800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,6]],"date-time":"2024-10-06T00:00:00Z","timestamp":1728172800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"NSF","doi-asserted-by":"publisher","award":["2324945"],"award-info":[{"award-number":["2324945"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,6]]},"DOI":"10.1109\/vlsi-soc62099.2024.10767834","type":"proceedings-article","created":{"date-parts":[[2024,12,3]],"date-time":"2024-12-03T18:53:02Z","timestamp":1733251982000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["A High Throughput, Energy-Efficient Architecture for Variable Precision Computing in DRAM"],"prefix":"10.1109","author":[{"given":"Gian","family":"Singh","sequence":"first","affiliation":[{"name":"Arizona State University,Tempe,AZ,USA"}]},{"given":"Ayushi","family":"Dube","sequence":"additional","affiliation":[{"name":"Arizona State University,Tempe,AZ,USA"}]},{"given":"Sarma","family":"Vrudhula","sequence":"additional","affiliation":[{"name":"Arizona State University,Tempe,AZ,USA"}]}],"member":"263","reference":[{"volume-title":"AI is harming our planet: addressing AI\u2019s staggering energy cost","year":"2022","author":"Lai","key":"ref1"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.18653\/v1\/P19-1355"},{"key":"ref3","article-title":"Sustainable AI: Environmental Implications","author":"Wu","year":"2021","journal-title":"Challenges and Opportunities"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.46506\/jica.2021.2.1.043"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757323"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2940649"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3061508"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3123939.3124544"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3195970.3196029"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA57654.2024.00030"},{"journal-title":"IEEE TCAD","article-title":"DRAM Bender: An Extensible and Versatile FPGA-Based Infrastructure to Easily Test State-of-the-Art DRAM Chips","year":"2023","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/3123939.3123977"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3583781.3590313"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3174101"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2857044"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2023.3268137"},{"volume-title":"Threshold logic and its applications","year":"1971","author":"Muroga","key":"ref17"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3164995"},{"volume-title":"DRAMPower: Open-source DRAM Power and Energy Estimation Tool","author":"Chandrasekar","key":"ref19"},{"key":"ref20","article-title":"ImageNet Classification with Deep Convolutional Neural Networks","author":"Krizhevsky","year":"2012","journal-title":"NeurIPS"},{"key":"ref21","article-title":"Deep residual learning for image recognition","author":"He","year":"2015","journal-title":"CoRR"},{"key":"ref22","article-title":"Very deep convolutional networks for large-scale image recognition","author":"Simonyan","year":"2015","journal-title":"CoRR"}],"event":{"name":"2024 IFIP\/IEEE 32nd International Conference on Very Large Scale Integration (VLSI-SoC)","start":{"date-parts":[[2024,10,6]]},"location":"Tanger, Morocco","end":{"date-parts":[[2024,10,9]]}},"container-title":["2024 IFIP\/IEEE 32nd International Conference on Very Large Scale Integration (VLSI-SoC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10767775\/10767782\/10767834.pdf?arnumber=10767834","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T19:55:15Z","timestamp":1736538915000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10767834\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,6]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/vlsi-soc62099.2024.10767834","relation":{},"subject":[],"published":{"date-parts":[[2024,10,6]]}}}