{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T07:49:21Z","timestamp":1725781761487},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,6]]},"DOI":"10.1109\/vlsic.2014.6858445","type":"proceedings-article","created":{"date-parts":[[2014,7,29]],"date-time":"2014-07-29T17:17:15Z","timestamp":1406654235000},"page":"1-2","source":"Crossref","is-referenced-by-count":12,"title":["A Column-Row-Parallel ASIC architecture for 3D wearable \/ portable medical ultrasonic imaging"],"prefix":"10.1109","author":[{"given":"Kailiang","family":"Chen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Hae-Seung Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Charles G.","family":"Sodini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","article-title":"A 256x256 2D array transducer with row-column addressing for 3D rectilinear imaging","author":"seo","year":"0","journal-title":"UFFC09"},{"key":"2","article-title":"Hybrid volume beamforming for 3D ultrasound imaging using 2D CMUT arrays","author":"kim","year":"0","journal-title":"Ultrasonics Symposium"},{"key":"1","article-title":"3D volumetric ultrasound imaging w\/a 32x32 CMUT array w\/front-end ICs using flip-chip bonding","author":"bhuyan","year":"0","journal-title":"ISSCC"},{"key":"4","article-title":"Ultrasonic imaging transceiver design for CMUT: A 3-level 30Vpp pulse-shaping pulser with improved efficiency and a noise-optimized receiver","author":"chen","year":"0","journal-title":"JSSC13"}],"event":{"name":"2014 IEEE Symposium on VLSI Circuits","start":{"date-parts":[[2014,6,10]]},"location":"Honolulu, HI, USA","end":{"date-parts":[[2014,6,13]]}},"container-title":["2014 Symposium on VLSI Circuits Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6850260\/6858353\/06858445.pdf?arnumber=6858445","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T15:14:29Z","timestamp":1490282069000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6858445\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,6]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/vlsic.2014.6858445","relation":{},"subject":[],"published":{"date-parts":[[2014,6]]}}}