{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,28]],"date-time":"2026-02-28T23:25:24Z","timestamp":1772321124698,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,6]]},"DOI":"10.1109\/vlsic.2015.7231374","type":"proceedings-article","created":{"date-parts":[[2015,9,3]],"date-time":"2015-09-03T17:50:20Z","timestamp":1441302620000},"page":"T222-T223","source":"Crossref","is-referenced-by-count":3,"title":["Active-lite interposer for 2.5 & 3D integration"],"prefix":"10.1109","author":[{"given":"G.","family":"Hellings","sequence":"first","affiliation":[]},{"given":"M.","family":"Scholz","sequence":"additional","affiliation":[]},{"given":"M.","family":"Detalle","sequence":"additional","affiliation":[]},{"given":"D.","family":"Velenis","sequence":"additional","affiliation":[]},{"given":"M.","family":"de Potter de ten Broeck","sequence":"additional","affiliation":[]},{"given":"C. Roda","family":"Neve","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Li","sequence":"additional","affiliation":[]},{"given":"S.","family":"Van Huylenbroek","sequence":"additional","affiliation":[]},{"given":"S.-H.","family":"Chen","sequence":"additional","affiliation":[]},{"given":"E.-J.","family":"Marinissen","sequence":"additional","affiliation":[]},{"given":"A. La","family":"Manna","sequence":"additional","affiliation":[]},{"given":"G.","family":"Van der Plas","sequence":"additional","affiliation":[]},{"given":"D.","family":"Linten","sequence":"additional","affiliation":[]},{"given":"E.","family":"Beyne","sequence":"additional","affiliation":[]},{"given":"A.","family":"Thean","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"514","author":"chen","year":"2014","journal-title":"IEDM Tech Digest"},{"key":"ref3","article-title":"Synopsys Sentaurus Sprocess","year":"2013"},{"key":"ref6","volume":"44","author":"jang","year":"2000","journal-title":"SSE"},{"key":"ref5","year":"0"},{"key":"ref8","first-page":"1","author":"taouil","year":"2013","journal-title":"3D\/C"},{"key":"ref7","year":"0","journal-title":"Angstrom Design Automation"},{"key":"ref2","first-page":"323","author":"detalle","year":"2013","journal-title":"ECTC"},{"key":"ref9","year":"2013"},{"key":"ref1","first-page":"635","author":"liao","year":"0","journal-title":"IEDM Tech Digest"}],"event":{"name":"2015 Symposium on VLSI Circuits","location":"Kyoto, Japan","start":{"date-parts":[[2015,6,17]]},"end":{"date-parts":[[2015,6,19]]}},"container-title":["2015 Symposium on VLSI Circuits (VLSI Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7196579\/7231231\/07231374.pdf?arnumber=7231374","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T01:53:07Z","timestamp":1490406787000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7231374\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,6]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/vlsic.2015.7231374","relation":{},"subject":[],"published":{"date-parts":[[2015,6]]}}}