{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,18]],"date-time":"2025-11-18T12:17:48Z","timestamp":1763468268151,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,6]]},"DOI":"10.1109\/vlsic.2015.7231375","type":"proceedings-article","created":{"date-parts":[[2015,9,3]],"date-time":"2015-09-03T21:50:20Z","timestamp":1441317020000},"page":"C192-C193","source":"Crossref","is-referenced-by-count":5,"title":["An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors"],"prefix":"10.1109","author":[{"given":"Kevin","family":"Tien","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Noah","family":"Sturcken","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naigang","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jae-woong","family":"Nah","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bing","family":"Dang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eugene","family":"O'Sullivan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paul","family":"Andry","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michele","family":"Petracca","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luca P.","family":"Carloni","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"William","family":"Gallagher","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kenneth","family":"Shepard","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","volume":"111","author":"wang","year":"2012","journal-title":"J Appl Phys"},{"key":"ref3","doi-asserted-by":"crossref","DOI":"10.1109\/TADVP.2005.850510","volume":"28","author":"chickamenahalli","year":"2005","journal-title":"IEEE Trans Adv Packaging"},{"key":"ref10","volume":"46","author":"kudva","year":"2011","journal-title":"IEEE JSSC"},{"key":"ref6","first-page":"446","author":"su","year":"2009","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2008.5388558"},{"key":"ref8","volume":"48","author":"huang","year":"2013","journal-title":"IEEE JSSC"},{"key":"ref7","first-page":"372","author":"le","year":"2013","journal-title":"ISSCC Dig Tech Papers"},{"journal-title":"APEC","year":"2014","author":"burton","key":"ref2"},{"key":"ref9","first-page":"400","author":"sturcken","year":"2012","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref1","volume":"31","author":"toprak-deniz","year":"2014","journal-title":"ISSCC Dig Tech Papers"}],"event":{"name":"2015 Symposium on VLSI Circuits","start":{"date-parts":[[2015,6,17]]},"location":"Kyoto, Japan","end":{"date-parts":[[2015,6,19]]}},"container-title":["2015 Symposium on VLSI Circuits (VLSI Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7196579\/7231231\/07231375.pdf?arnumber=7231375","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T18:54:45Z","timestamp":1498244085000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7231375\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,6]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/vlsic.2015.7231375","relation":{},"subject":[],"published":{"date-parts":[[2015,6]]}}}