{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,24]],"date-time":"2026-04-24T14:52:25Z","timestamp":1777042345737,"version":"3.51.4"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,6]]},"DOI":"10.1109\/vlsic.2018.8502269","type":"proceedings-article","created":{"date-parts":[[2018,11,16]],"date-time":"2018-11-16T03:04:38Z","timestamp":1542337478000},"page":"81-82","source":"Crossref","is-referenced-by-count":115,"title":["SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories"],"prefix":"10.1109","author":[{"given":"K.","family":"Garello","sequence":"first","affiliation":[]},{"given":"F.","family":"Yasin","sequence":"additional","affiliation":[]},{"given":"S.","family":"Couet","sequence":"additional","affiliation":[]},{"given":"L.","family":"Souriau","sequence":"additional","affiliation":[]},{"given":"J.","family":"Swerts","sequence":"additional","affiliation":[]},{"given":"S.","family":"Rao","sequence":"additional","affiliation":[]},{"given":"S.","family":"Van Beek","sequence":"additional","affiliation":[]},{"given":"W.","family":"Kim","sequence":"additional","affiliation":[]},{"given":"E.","family":"Liu","sequence":"additional","affiliation":[]},{"given":"S.","family":"Kundu","sequence":"additional","affiliation":[]},{"given":"D.","family":"Tsvetanova","sequence":"additional","affiliation":[]},{"given":"K.","family":"Croes","sequence":"additional","affiliation":[]},{"given":"N.","family":"Jossart","sequence":"additional","affiliation":[]},{"given":"E.","family":"Grimaldi","sequence":"additional","affiliation":[]},{"given":"M.","family":"Baumgartner","sequence":"additional","affiliation":[]},{"given":"D.","family":"Crotti","sequence":"additional","affiliation":[]},{"given":"A.","family":"Fumemont","sequence":"additional","affiliation":[]},{"given":"P.","family":"Gambardella","sequence":"additional","affiliation":[]},{"given":"G.S.","family":"Kar","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","author":"cubucku","year":"2017","journal-title":"ArXiv"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TMSCS.2015.2509963"},{"key":"ref6","doi-asserted-by":"crossref","DOI":"10.1063\/1.4753947","volume":"101","author":"pai","year":"2012","journal-title":"App Phys Lett"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2017.151"},{"key":"ref2","first-page":"555","volume":"336","author":"miron","year":"2011","journal-title":"Nature"},{"key":"ref1","doi-asserted-by":"crossref","DOI":"10.1103\/PhysRevLett.100.057206","volume":"100","author":"devolder","year":"2008","journal-title":"Phys Rev Lett"}],"event":{"name":"2018 IEEE Symposium on VLSI Circuits","location":"Honolulu, HI","start":{"date-parts":[[2018,6,18]]},"end":{"date-parts":[[2018,6,22]]}},"container-title":["2018 IEEE Symposium on VLSI Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8484863\/8502213\/08502269.pdf?arnumber=8502269","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,24]],"date-time":"2020-08-24T05:34:57Z","timestamp":1598247297000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8502269\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,6]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/vlsic.2018.8502269","relation":{},"subject":[],"published":{"date-parts":[[2018,6]]}}}