{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T15:44:35Z","timestamp":1730303075819,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,6]]},"DOI":"10.1109\/vlsic.2018.8502340","type":"proceedings-article","created":{"date-parts":[[2018,11,16]],"date-time":"2018-11-16T03:04:38Z","timestamp":1542337478000},"page":"149-150","source":"Crossref","is-referenced-by-count":2,"title":["A 12.8 GB\/S Daisy Chain-Based Downlink I\/F Employing Spectrally Compressed Multi-Band Multiplexing for High-Bandwidth and Large-Capacity Storage Systems"],"prefix":"10.1109","author":[{"given":"Yuta","family":"Tsubouchi","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daisuke","family":"Miyashita","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuji","family":"Satoh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takashi","family":"Toi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fumihiko","family":"Tachibana","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Makoto","family":"Morimoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Junii","family":"Wadatsumi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Deguchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"194c","author":"kim","year":"2017","journal-title":"IEEE Symp VLSI Circuit"},{"key":"ref3","first-page":"202","author":"kim","year":"2017","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref6","first-page":"1","author":"pawlowski","year":"2011","journal-title":"IEEE Hot Chips Symposium"},{"key":"ref5","first-page":"462","author":"pfaff","year":"2008","journal-title":"ISSCC Dig Tech Papers"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/MSP.2011.940267"},{"key":"ref7","first-page":"1111","volume":"52","author":"du","year":"2017","journal-title":"IEEE JSSC"},{"key":"ref2","first-page":"196","author":"yamashita","year":"2017","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref1","volume":"10 62","author":"mikula","year":"2016","journal-title":"Frontiers in Neuroanatomy"}],"event":{"name":"2018 IEEE Symposium on VLSI Circuits","start":{"date-parts":[[2018,6,18]]},"location":"Honolulu, HI","end":{"date-parts":[[2018,6,22]]}},"container-title":["2018 IEEE Symposium on VLSI Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8484863\/8502213\/08502340.pdf?arnumber=8502340","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,24]],"date-time":"2020-08-24T00:17:06Z","timestamp":1598228226000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8502340\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,6]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/vlsic.2018.8502340","relation":{},"subject":[],"published":{"date-parts":[[2018,6]]}}}