{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T06:49:19Z","timestamp":1773816559677,"version":"3.50.1"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,1,3]],"date-time":"2026-01-03T00:00:00Z","timestamp":1767398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,1,3]],"date-time":"2026-01-03T00:00:00Z","timestamp":1767398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100005440","name":"CSR","doi-asserted-by":"publisher","award":["WMGT-23-0001"],"award-info":[{"award-number":["WMGT-23-0001"]}],"id":[{"id":"10.13039\/100005440","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,1,3]]},"DOI":"10.1109\/vlsid68508.2026.00078","type":"proceedings-article","created":{"date-parts":[[2026,3,17]],"date-time":"2026-03-17T20:19:04Z","timestamp":1773778744000},"page":"377-382","source":"Crossref","is-referenced-by-count":0,"title":["Cost and Communication-Aware Fast Placement of Processing Elements in Chiplets for 2.5D Systems"],"prefix":"10.1109","author":[{"given":"Ayman Un","family":"Nisa","sequence":"first","affiliation":[{"name":"Indian Institute of Science,Bangalore,India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ashok","family":"Jagannathan","sequence":"additional","affiliation":[{"name":"Agrani Labs,India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sumit K.","family":"Mandal","sequence":"additional","affiliation":[{"name":"Indian Institute of Science,Bangalore,India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2017.243"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref3","article-title":"Attention is all you Need","author":"Vaswani","year":"2017","journal-title":"arXiv preprint"},{"key":"ref4","year":"2024","journal-title":"Intel Xeon Gold"},{"key":"ref5","year":"2024","journal-title":"AMD EPYC"},{"key":"ref6","year":"2024","journal-title":"Amazon Graviton"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/66.53188"},{"key":"ref8","first-page":"121","article-title":"Chiplet actuary: A Quantitative Cost Model and Multi-chiplet Architecture Exploration","volume-title":"Proceedings of the 59th ACM\/IEEE DAC","author":"Feng","year":"2022"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3476999"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2022.3197500"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358302"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2024.3427421"},{"key":"ref13","article-title":"Cost-aware exploration for chiplet-based architecture with advanced packaging technologies","author":"Tang","year":"2022","journal-title":"arXiv preprint"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2980095"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317775"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.3390\/mi13020205"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2013.6557149"}],"event":{"name":"2026 39th International Conference on VLSI Design & 25th International Conference on Embedded Systems (VLSID)","location":"Pune, India","start":{"date-parts":[[2026,1,3]]},"end":{"date-parts":[[2026,1,7]]}},"container-title":["2026 39th International Conference on VLSI Design & 25th International Conference on Embedded Systems (VLSID)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11433189\/11433171\/11433173.pdf?arnumber=11433173","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T05:50:59Z","timestamp":1773813059000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11433173\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,1,3]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/vlsid68508.2026.00078","relation":{},"subject":[],"published":{"date-parts":[[2026,1,3]]}}}