{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T20:50:19Z","timestamp":1775681419563,"version":"3.50.1"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,1,3]],"date-time":"2026-01-03T00:00:00Z","timestamp":1767398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,1,3]],"date-time":"2026-01-03T00:00:00Z","timestamp":1767398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,1,3]]},"DOI":"10.1109\/vlsid68508.2026.00101","type":"proceedings-article","created":{"date-parts":[[2026,3,17]],"date-time":"2026-03-17T20:19:04Z","timestamp":1773778744000},"page":"512-517","source":"Crossref","is-referenced-by-count":0,"title":["ThermLeT: Transformer-Based Temperature Prediction for 2.5D Chiplet Architecture"],"prefix":"10.1109","author":[{"given":"Varun Darshana","family":"Parekh","sequence":"first","affiliation":[{"name":"The Pennsylvania State University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anusha","family":"Devulapally","sequence":"additional","affiliation":[{"name":"The Pennsylvania State University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sivani","family":"Devarapalli","sequence":"additional","affiliation":[{"name":"The Pennsylvania State University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cassius","family":"Henderson","sequence":"additional","affiliation":[{"name":"The Pennsylvania State University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shimeng","family":"Yu","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vijaykrishnan","family":"Narayanan","sequence":"additional","affiliation":[{"name":"The Pennsylvania State University"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","article-title":"System on a Chip Explained: Understanding SoC Technology","author":"Panchapakesan","year":"2022","journal-title":"Synopsys"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-031-71436-8_8"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC62800.2024.10909778"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00251"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063103"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247998"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/iTherm54085.2022.9899649"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474011"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD65941.2025.00029"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC52403.2022.9712583"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTS60656.2024.10538578"},{"key":"ref12","first-page":"690","article-title":"Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks","volume-title":"26th Asia and South Pacific Design Automation Conference (ASP-DAC)","author":"Chhabria","year":"2021"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/3532185"},{"key":"ref15","article-title":"Fast SoC thermal simulation with physics-aware U-Net","volume-title":"Machine Learning and Physical Sciences Workshop","author":"Lin","year":"2023"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC62800.2024.10909871"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/3309544"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ACES-China62474.2024.10700022"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2023.3275156"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/3658617.3703134"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/cvprw63382.2024.00213"}],"event":{"name":"2026 39th International Conference on VLSI Design & 25th International Conference on Embedded Systems (VLSID)","location":"Pune, India","start":{"date-parts":[[2026,1,3]]},"end":{"date-parts":[[2026,1,7]]}},"container-title":["2026 39th International Conference on VLSI Design & 25th International Conference on Embedded Systems (VLSID)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11433189\/11433171\/11433292.pdf?arnumber=11433292","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T20:01:44Z","timestamp":1775678504000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11433292\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,1,3]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/vlsid68508.2026.00101","relation":{},"subject":[],"published":{"date-parts":[[2026,1,3]]}}}