{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T14:13:30Z","timestamp":1773843210027,"version":"3.50.1"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830252","type":"proceedings-article","created":{"date-parts":[[2022,7,22]],"date-time":"2022-07-22T16:42:52Z","timestamp":1658508172000},"page":"190-191","source":"Crossref","is-referenced-by-count":8,"title":["A 3nm GAAFET Analog Assisted Digital LDO with High Current Density for Dynamic Voltage Scaling Mobile Applications"],"prefix":"10.1109","author":[{"given":"Seki","family":"Kim","sequence":"first","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Hyongmin","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Yongjin","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Dongha","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Byeongbae","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Jahoon","family":"Jin","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Susie","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Miri","family":"Noh","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Kwonwoo","family":"Kang","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Sangho","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Takahiro","family":"Nomiyama","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Ji-Seon","family":"Paek","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]},{"given":"Jongwoo","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,South Korea"}]}],"member":"263","reference":[{"key":"ref4","first-page":"231","author":"park","year":"2018","journal-title":"IEEE VLSI"},{"key":"ref3","first-page":"2402","volume":"56","author":"liu","year":"2021","journal-title":"IEEE JSSC"},{"key":"ref6","volume":"29","author":"jung","year":"2021","journal-title":"IEEE ISSCC"},{"key":"ref5","first-page":"380","author":"bang","year":"2020","journal-title":"IEEE ISSCC"},{"key":"ref8","first-page":"388","volume":"33","author":"yoon","year":"2018","journal-title":"IEEE TPE"},{"key":"ref7","first-page":"511","volume":"56","author":"chen","year":"2021","journal-title":"IEEE JSSC"},{"key":"ref2","first-page":"2140","volume":"55","author":"zhou","year":"2020","journal-title":"IEEE JSSC"},{"key":"ref1","first-page":"384","author":"he","year":"2020","journal-title":"IEEE ISSCC"}],"event":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2022,6,12]]},"end":{"date-parts":[[2022,6,17]]}},"container-title":["2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9830116\/9830138\/09830252.pdf?arnumber=9830252","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,15]],"date-time":"2022-08-15T20:03:43Z","timestamp":1660593823000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9830252\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46769.2022.9830252","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}