{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,6]],"date-time":"2026-02-06T00:06:08Z","timestamp":1770336368602,"version":"3.49.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830385","type":"proceedings-article","created":{"date-parts":[[2022,7,22]],"date-time":"2022-07-22T12:42:52Z","timestamp":1658493772000},"page":"192-193","source":"Crossref","is-referenced-by-count":3,"title":["Fully Integrated Voltage Regulators with Package-Embedded Inductors for Heterogeneous 3D-TSV-Stacked System-in-Package with 22nm CMOS Active Silicon Interposer Featuring Self-Trimmed, Digitally Controlled ON-Time Discontinuous Conduction Mode (DCM) Operation"],"prefix":"10.1109","author":[{"given":"Nachiket","family":"Desai","sequence":"first","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Harish K.","family":"Krishnamurthy","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Suhwan","family":"Kim","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christopher","family":"Schaef","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheldon","family":"Weng","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Beomseok","family":"Choi","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"William J.","family":"Lambert","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Krishnan","family":"Ravichandran","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"James W.","family":"Tschanz","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vivek","family":"De","sequence":"additional","affiliation":[{"name":"Intel Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"3316","volume":"54","author":"schaef","year":"2019","journal-title":"IEEE JSSC"},{"key":"ref3","first-page":"1940","volume":"46","author":"kudva","year":"2011","journal-title":"IEEE JSSC"},{"key":"ref6","first-page":"400","author":"sturcken","year":"2012","journal-title":"ISSCC"},{"key":"ref5","first-page":"262","author":"desai","year":"2021","journal-title":"ISSCC"},{"key":"ref2","first-page":"148c","author":"krishnamurthy","year":"2017","journal-title":"VLSI"},{"key":"ref1","volume":"6","author":"lambert","year":"2016","journal-title":"IEEE TCPMT"}],"event":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2022,6,12]]},"end":{"date-parts":[[2022,6,17]]}},"container-title":["2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9830116\/9830138\/09830385.pdf?arnumber=9830385","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,15]],"date-time":"2022-08-15T16:03:46Z","timestamp":1660579426000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9830385\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46769.2022.9830385","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}