{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,7]],"date-time":"2026-05-07T16:06:30Z","timestamp":1778169990310,"version":"3.51.4"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830418","type":"proceedings-article","created":{"date-parts":[[2022,7,22]],"date-time":"2022-07-22T16:42:52Z","timestamp":1658508172000},"page":"224-225","source":"Crossref","is-referenced-by-count":11,"title":["Few-shot graph learning with robust and energy-efficient memory-augmented graph neural network (MAGNN) based on homogeneous computing-in-memory"],"prefix":"10.1109","author":[{"given":"Woyu","family":"Zhang","sequence":"first","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Shaocong","family":"Wang","sequence":"additional","affiliation":[{"name":"the University of Hong Kong,Department of Electrical and Electronic Engineering,Hong Kong,China"}]},{"given":"Yi","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Xiaoxin","family":"Xu","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Danian","family":"Dong","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Nanjia","family":"Jiang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Fei","family":"Wang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Zeyu","family":"Guo","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Renrui","family":"Fang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Chunmeng","family":"Dou","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Kai","family":"Ni","sequence":"additional","affiliation":[{"name":"Rochester Institute of Technology,Rochester,NY,USA"}]},{"given":"Zhongrui","family":"Wang","sequence":"additional","affiliation":[{"name":"the University of Hong Kong,Department of Electrical and Electronic Engineering,Hong Kong,China"}]},{"given":"Dashan","family":"Shang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]},{"given":"Ming","family":"Liu","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China"}]}],"member":"263","reference":[{"key":"ref4","author":"li","year":"2021","journal-title":"VLSI"},{"key":"ref3","author":"lin","year":"2016","journal-title":"ISSCC"},{"key":"ref6","author":"li","year":"2021","journal-title":"IEDM"},{"key":"ref5","author":"dutta","year":"2021","journal-title":"IEDM"},{"key":"ref8","author":"wang","year":"0"},{"key":"ref7","author":"sun","year":"2021","journal-title":"VLSI"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-019-0321-3"},{"key":"ref9","first-page":"93","volume":"29","author":"sen","year":"2008","journal-title":"AI Mag"},{"key":"ref1","first-page":"1842","volume":"48","author":"santoro","year":"2016","journal-title":"Machine Learning Research"}],"event":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2022,6,12]]},"end":{"date-parts":[[2022,6,17]]}},"container-title":["2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9830116\/9830138\/09830418.pdf?arnumber=9830418","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,8]],"date-time":"2022-08-08T20:02:28Z","timestamp":1659988948000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9830418\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46769.2022.9830418","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}