{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,9]],"date-time":"2026-02-09T14:57:38Z","timestamp":1770649058000,"version":"3.49.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830425","type":"proceedings-article","created":{"date-parts":[[2022,7,22]],"date-time":"2022-07-22T16:42:52Z","timestamp":1658508172000},"page":"383-384","source":"Crossref","is-referenced-by-count":10,"title":["Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC"],"prefix":"10.1109","author":[{"given":"Juhyuk","family":"Park","sequence":"first","affiliation":[{"name":"KAIST,School of Electrical Engineering,Daejeon,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dae-Myeong","family":"Geum","sequence":"additional","affiliation":[{"name":"KAIST,Infromation and Electronics Research Institute,Daejeon,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Woojin","family":"Baek","sequence":"additional","affiliation":[{"name":"KAIST,School of Electrical Engineering,Daejeon,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Johnson","family":"Shieh","sequence":"additional","affiliation":[{"name":"Jasper Display Corp,California,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sanghyeon","family":"Kim","sequence":"additional","affiliation":[{"name":"KAIST,School of Electrical Engineering,Daejeon,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1364\/OE.26.011194"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/jsid.516"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1364\/PRJ.5.000A23"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1002\/jsid.649"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/OE.411591"},{"key":"ref8","first-page":"202","author":"meng","year":"2021","journal-title":"IEDM"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/s41566-021-00783-1"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1039\/C9NR04423J"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2021.3078198"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2018.2802840"}],"event":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2022,6,12]]},"end":{"date-parts":[[2022,6,17]]}},"container-title":["2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9830116\/9830138\/09830425.pdf?arnumber=9830425","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,8]],"date-time":"2022-08-08T20:02:33Z","timestamp":1659988953000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9830425\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46769.2022.9830425","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}