{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T08:41:33Z","timestamp":1770712893447,"version":"3.49.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,12]],"date-time":"2022-06-12T00:00:00Z","timestamp":1654992000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100006180","name":"Technology Development","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006180","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,12]]},"DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830488","type":"proceedings-article","created":{"date-parts":[[2022,7,22]],"date-time":"2022-07-22T16:42:52Z","timestamp":1658508172000},"page":"423-424","source":"Crossref","is-referenced-by-count":8,"title":["Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects"],"prefix":"10.1109","author":[{"given":"Takeshi","family":"Nogami","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Oleg","family":"Gluschenkov","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yasir","family":"Sulehria","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Son","family":"Nguyen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Brown","family":"Peethala","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huai","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hosadurga","family":"Shobha","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nick","family":"Lanzillo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Raghuveer","family":"Patlolla","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Devika","family":"Sil","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andrew","family":"Simon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniel","family":"Edelstein","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nelson","family":"Felix","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Junjun","family":"Liu","sequence":"additional","affiliation":[{"name":"SCREEN Semiconductor Solutions Co., Ltd.,IBM Research,Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshiyuki","family":"Tabata","sequence":"additional","affiliation":[{"name":"Laser Systems & Solutions of Europe (LASSE),Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fulvio","family":"Mazzamuto","sequence":"additional","affiliation":[{"name":"Laser Systems & Solutions of Europe (LASSE),Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sebastien","family":"Halty","sequence":"additional","affiliation":[{"name":"Laser Systems & Solutions of Europe (LASSE),Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fabien","family":"Roze","sequence":"additional","affiliation":[{"name":"Laser Systems & Solutions of Europe (LASSE),Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yasutoshi","family":"Okuno","sequence":"additional","affiliation":[{"name":"SCREEN Semiconductor Solutions Co., Ltd.,IBM Research,Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Akira","family":"Uedono","sequence":"additional","affiliation":[{"name":"Tsukuba University,Albany,NY,USA,12203"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","volume":"8","author":"nogami","year":"2015","journal-title":"IEDM"},{"key":"ref3","volume":"33","author":"nogami","year":"2010","journal-title":"IEDM"},{"key":"ref10","first-page":"tc3.3","author":"bhosale","year":"2020","journal-title":"VLSI Symp"},{"key":"ref6","first-page":"t2-2","author":"nogami","year":"2019","journal-title":"VLI Symp"},{"key":"ref11","author":"sil","year":"2021","journal-title":"IITC"},{"key":"ref5","first-page":"t11.5","author":"nogami","year":"2017","journal-title":"VLSI Symp"},{"key":"ref8","first-page":"222","author":"hu","year":"2004","journal-title":"IRPS"},{"key":"ref7","first-page":"3f-4","author":"simon","year":"2013","journal-title":"IRPS"},{"key":"ref2","author":"nogami","year":"2020","journal-title":"IITC"},{"key":"ref9","author":"nogami","year":"2017","journal-title":"IITC"},{"key":"ref1","volume":"22","author":"nogami","year":"2021","journal-title":"IEDM"}],"event":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2022,6,12]]},"end":{"date-parts":[[2022,6,17]]}},"container-title":["2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9830116\/9830138\/09830488.pdf?arnumber=9830488","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,15]],"date-time":"2022-08-15T20:04:04Z","timestamp":1660593844000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9830488\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,12]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46769.2022.9830488","relation":{},"subject":[],"published":{"date-parts":[[2022,6,12]]}}}