{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,25]],"date-time":"2026-01-25T06:05:51Z","timestamp":1769321151865,"version":"3.49.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,6,16]]},"DOI":"10.1109\/vlsitechnologyandcir46783.2024.10631337","type":"proceedings-article","created":{"date-parts":[[2024,8,26]],"date-time":"2024-08-26T17:23:31Z","timestamp":1724693011000},"page":"1-2","source":"Crossref","is-referenced-by-count":6,"title":["A Novel Phase Change Material RF Switch with 16nm Technology to Achieve Low Voltage and Low Ron*Coff for mmWave"],"prefix":"10.1109","author":[{"given":"H.J.","family":"Li","sequence":"first","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"K.P.","family":"Chang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"C.E.","family":"Chen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"W.T","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"H.H.","family":"Kuo","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"C.C.","family":"Huang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"H.C.","family":"Chen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"Z.H.","family":"Ya","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"H.Y.","family":"Chen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"J.D.","family":"Jin","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"S. H.","family":"Yang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"Y.W.","family":"Ting","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"K.C.","family":"Tseng","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"K.C.","family":"Huang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"Harry","family":"Chuang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]}],"member":"263","reference":[{"key":"ref1","volume":"45","author":"El-Hinnawy","year":"2020","journal-title":"IEEE IMS"},{"key":"ref2","author":"Young","year":"2014","journal-title":"Appl. Phys"},{"key":"ref3","year":"2018","journal-title":"Balasubramaniyan, IEEE S3S"},{"key":"ref4","volume":"109","author":"Gheysens","year":"2023","journal-title":"IEEE ESSDERC"},{"issue":"93","key":"ref5","volume":"89","author":"Navarro","year":"2013","journal-title":"Solid-state electronics"},{"key":"ref6","volume":"836","author":"Moon","year":"2018","journal-title":"IEEE IMS"}],"event":{"name":"2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2024,6,16]]},"end":{"date-parts":[[2024,6,20]]}},"container-title":["2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10631290\/10631310\/10631337.pdf?arnumber=10631337","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,30]],"date-time":"2024-08-30T10:39:37Z","timestamp":1725014377000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10631337\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,16]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46783.2024.10631337","relation":{},"subject":[],"published":{"date-parts":[[2024,6,16]]}}}