{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,25]],"date-time":"2026-04-25T14:37:01Z","timestamp":1777127821762,"version":"3.51.4"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000185","name":"DARPA","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,6,16]]},"DOI":"10.1109\/vlsitechnologyandcir46783.2024.10631353","type":"proceedings-article","created":{"date-parts":[[2024,8,26]],"date-time":"2024-08-26T17:23:31Z","timestamp":1724693011000},"page":"1-2","source":"Crossref","is-referenced-by-count":3,"title":["A 400-ns-Settling- Time Hybrid Dynamic Voltage Frequency Scaling Architecture and Its Application in a 22-Core Network-on-Chip SoC in 12-nm FinFET Technology"],"prefix":"10.1109","author":[{"given":"Erik","family":"Loscalzo","sequence":"first","affiliation":[{"name":"Columbia University,New York,NY"}]},{"given":"Martin","family":"Cochet","sequence":"additional","affiliation":[{"name":"IBM Research,Yorktown Heights,NY"}]},{"given":"Joseph","family":"Zuckerman","sequence":"additional","affiliation":[{"name":"Columbia University,New York,NY"}]},{"given":"Samira","family":"Zalias","sequence":"additional","affiliation":[{"name":"Columbia University,New York,NY"}]},{"given":"Michael","family":"Lekas","sequence":"additional","affiliation":[{"name":"Ferric Inc.,New York,NY"}]},{"given":"Stephen","family":"Cahill","sequence":"additional","affiliation":[{"name":"Ferric Inc.,New York,NY"}]},{"given":"Tianyu","family":"Jia","sequence":"additional","affiliation":[{"name":"Harvard University,Cambridge,MA"}]},{"given":"Karthik","family":"Swaminathan","sequence":"additional","affiliation":[{"name":"IBM Research,Yorktown Heights,NY"}]},{"given":"Maico Cassel","family":"dos Santos","sequence":"additional","affiliation":[{"name":"Columbia University,New York,NY"}]},{"given":"Davide","family":"Giri","sequence":"additional","affiliation":[{"name":"Columbia University,New York,NY"}]},{"given":"Hesam","family":"Sadeghi","sequence":"additional","affiliation":[{"name":"Ferric Inc.,New York,NY"}]},{"given":"Joseph","family":"Meyer","sequence":"additional","affiliation":[{"name":"Ferric Inc.,New York,NY"}]},{"given":"Noah","family":"Sturcken","sequence":"additional","affiliation":[{"name":"Ferric Inc.,New York,NY"}]},{"given":"David","family":"Brooks","sequence":"additional","affiliation":[{"name":"Harvard University,Cambridge,MA"}]},{"given":"Gu-Yeon","family":"Wei","sequence":"additional","affiliation":[{"name":"Harvard University,Cambridge,MA"}]},{"given":"Luca","family":"Carloni","sequence":"additional","affiliation":[{"name":"Columbia University,New York,NY"}]},{"given":"Pradip","family":"Bose","sequence":"additional","affiliation":[{"name":"IBM Research,Yorktown Heights,NY"}]},{"given":"Kenneth","family":"Shepard","sequence":"additional","affiliation":[{"name":"Columbia University,New York,NY"}]}],"member":"263","reference":[{"key":"ref1","author":"Cassel dos Santos","year":"2024","journal-title":"ISSCC"},{"issue":"1","key":"ref2","first-page":"144","volume":"54","author":"Meinerzhagen","year":"2019","journal-title":"IEEE JSSC"},{"issue":"11","key":"ref3","first-page":"4627","volume":"70","author":"Wang","year":"2023","journal-title":"IEEE TCAS"},{"issue":"1","key":"ref4","first-page":"109","volume":"54","author":"Kundu","year":"2019","journal-title":"IEEE JSSC"},{"issue":"4","key":"ref5","first-page":"1173","volume":"54","author":"Rahman","journal-title":"IEEE JSSC"},{"key":"ref6","first-page":"1","author":"Sun","year":"2020","journal-title":"VLSL"},{"key":"ref7","first-page":"316","author":"Atallah","year":"2019","journal-title":"ISSCC"},{"issue":"1","key":"ref8","first-page":"90","volume":"57","author":"Huang","year":"2022","journal-title":"IEEE JSSC"},{"key":"ref9","first-page":"C192","author":"Tien","year":"2015","journal-title":"VLSI"},{"key":"ref10","first-page":"1051","author":"Haj-Yahya","year":"2020","journal-title":"IEEE\/ACM MICRO"}],"event":{"name":"2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2024,6,16]]},"end":{"date-parts":[[2024,6,20]]}},"container-title":["2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10631290\/10631310\/10631353.pdf?arnumber=10631353","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T04:58:38Z","timestamp":1725339518000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10631353\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,16]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46783.2024.10631353","relation":{},"subject":[],"published":{"date-parts":[[2024,6,16]]}}}