{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,24]],"date-time":"2026-04-24T14:58:24Z","timestamp":1777042704546,"version":"3.51.4"},"reference-count":4,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,6,16]]},"DOI":"10.1109\/vlsitechnologyandcir46783.2024.10631392","type":"proceedings-article","created":{"date-parts":[[2024,8,26]],"date-time":"2024-08-26T17:23:31Z","timestamp":1724693011000},"page":"1-2","source":"Crossref","is-referenced-by-count":11,"title":["Expanding Design Technology Co-Optimization Potentials with Back-Side Interconnect Innovation"],"prefix":"10.1109","author":[{"given":"Byung-Sung","family":"Kim","sequence":"first","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Subin","family":"Choi","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Jung Han","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Kwangmuk","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Jisoo","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Jiwook","family":"Kwon","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Saehan","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Kwanyoung","family":"Chun","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Harsono","family":"Simka","sequence":"additional","affiliation":[{"name":"Samsung Semiconductor Inc.,Logic Pathfinding Lab,San Jose,CA,USA"}]},{"given":"Aravindh","family":"Kumar","sequence":"additional","affiliation":[{"name":"Samsung Semiconductor Inc.,Logic Pathfinding Lab,San Jose,CA,USA"}]},{"given":"Muhammed Ahosan","family":"Ul Karim","sequence":"additional","affiliation":[{"name":"Samsung Semiconductor Inc.,Logic Pathfinding Lab,San Jose,CA,USA"}]},{"given":"Ken","family":"Rim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]},{"given":"Jaihyuk","family":"Song","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd.,Semiconductor R&D Center,Hwaseong-Si,Korea"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"IEDM","author":"Choi","year":"2023"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.5772\/139"},{"key":"ref3","volume-title":"IITC","author":"Kim","year":"2023"},{"key":"ref4","volume-title":"IEDM","author":"Kobrinsky","year":"2023"}],"event":{"name":"2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2024,6,16]]},"end":{"date-parts":[[2024,6,20]]}},"container-title":["2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10631290\/10631310\/10631392.pdf?arnumber=10631392","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T05:11:29Z","timestamp":1725340289000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10631392\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,16]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46783.2024.10631392","relation":{},"subject":[],"published":{"date-parts":[[2024,6,16]]}}}