{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T07:56:24Z","timestamp":1770278184284,"version":"3.49.0"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,16]],"date-time":"2024-06-16T00:00:00Z","timestamp":1718496000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001863","name":"New Energy and Industrial Technology Development Organization","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001863","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,6,16]]},"DOI":"10.1109\/vlsitechnologyandcir46783.2024.10631453","type":"proceedings-article","created":{"date-parts":[[2024,8,26]],"date-time":"2024-08-26T17:23:31Z","timestamp":1724693011000},"page":"1-2","source":"Crossref","is-referenced-by-count":2,"title":["Terahertz Sensing with CMOS-RFIC - Feasibility Verification for Short-Range Imaging using 300GHz MIMO Radar -"],"prefix":"10.1109","author":[{"given":"Ichiro","family":"Somada","sequence":"first","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Akihito","family":"Hirai","sequence":"additional","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Keigo","family":"Nakatani","sequence":"additional","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Akinori","family":"Taira","sequence":"additional","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kazuaki","family":"Ishioka","sequence":"additional","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takuma","family":"Nishimura","sequence":"additional","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Koji","family":"Yamanaka","sequence":"additional","affiliation":[{"name":"Information Technology R&D Center, Mitsubishi Electric Corporation,Kanagawa,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","author":"Heimbeck","year":"2011","journal-title":"IRMMW"},{"issue":"3","key":"ref2","volume":"6","author":"Petrov","year":"2016","journal-title":"IEEE Trans. on Terahertz"},{"issue":"2","key":"ref3","volume":"5","author":"Zhong","year":"2005","journal-title":"IEEE Sensor Journal"},{"issue":"ll","key":"ref4","volume":"55","author":"Appleby","year":"2007","journal-title":"IEEE Trans. on AP"},{"issue":"10","key":"ref5","volume":"52","author":"Siegel","year":"2004","journal-title":"IEEE Trans. on Microwave"},{"issue":"7","key":"ref6","doi-asserted-by":"crossref","DOI":"10.1587\/comex.2023XBL0038","volume":"12","author":"Sameshima","year":"2023","journal-title":"IEICE ComEx"},{"key":"ref7","author":"Tsuchida","year":"2023","journal-title":"URSI GASS"},{"key":"ref8","author":"Hirai","year":"2023","journal-title":"APMC"},{"key":"ref9","author":"Tokgoz","year":"2019","journal-title":"IEEE Microw. Wireless Compon. Lett."}],"event":{"name":"2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","location":"Honolulu, HI, USA","start":{"date-parts":[[2024,6,16]]},"end":{"date-parts":[[2024,6,20]]}},"container-title":["2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10631290\/10631310\/10631453.pdf?arnumber=10631453","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T11:34:45Z","timestamp":1725449685000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10631453\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,16]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/vlsitechnologyandcir46783.2024.10631453","relation":{},"subject":[],"published":{"date-parts":[[2024,6,16]]}}}