{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T04:57:25Z","timestamp":1725771445662},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,4,24]],"date-time":"2023-04-24T00:00:00Z","timestamp":1682294400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,24]],"date-time":"2023-04-24T00:00:00Z","timestamp":1682294400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,4,24]]},"DOI":"10.1109\/vts56346.2023.10139991","type":"proceedings-article","created":{"date-parts":[[2023,6,2]],"date-time":"2023-06-02T19:35:17Z","timestamp":1685734517000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["An Efficient External Memory Test Solution: Case Study for HPC Application"],"prefix":"10.1109","author":[{"given":"Keqing","family":"Ouyang","sequence":"first","affiliation":[{"name":"Sanechips"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Minqiang","family":"Peng","sequence":"additional","affiliation":[{"name":"Sanechips"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yunnong","family":"Zhu","sequence":"additional","affiliation":[{"name":"Sanechips"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kang","family":"Qi","sequence":"additional","affiliation":[{"name":"Sanechips"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Grigor","family":"Tshagharyan","sequence":"additional","affiliation":[{"name":"Synopsys"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Arun","family":"Kumar","sequence":"additional","affiliation":[{"name":"Synopsys"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gurgen","family":"Harutyunyan","sequence":"additional","affiliation":[{"name":"Synopsys"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Isaac","family":"Wang","sequence":"additional","affiliation":[{"name":"Synopsys"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IMW.2017.7939084"},{"journal-title":"High-bandwidth Memory (HBM) DRAM","year":"2013","key":"ref7"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2015.7229852"},{"year":"2019","key":"ref4","article-title":"Memory Tradeoffs Intensify In AI, Automotive Applications, Semiconductor Engineering"},{"journal-title":"IEEE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS 2022 Update BEYOND CMOS AND EMERGING MATERIALS INTEGRATION","year":"0","key":"ref3"},{"journal-title":"JEDEC Standard - Low Power Double Data Rate 2 (LPDDR2)","year":"2010","key":"ref6"},{"journal-title":"Double Data Rate (DDR) SDRAM","year":"2008","key":"ref5"},{"journal-title":"Semico Roadmap for Die Area Partitioning","year":"2017","key":"ref2"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-540-74309-5_12"}],"event":{"name":"2023 IEEE 41st VLSI Test Symposium (VTS)","start":{"date-parts":[[2023,4,24]]},"location":"San Diego, CA, USA","end":{"date-parts":[[2023,4,26]]}},"container-title":["2023 IEEE 41st VLSI Test Symposium (VTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10139918\/10139926\/10139991.pdf?arnumber=10139991","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,19]],"date-time":"2023-06-19T17:49:30Z","timestamp":1687196970000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10139991\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4,24]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/vts56346.2023.10139991","relation":{},"subject":[],"published":{"date-parts":[[2023,4,24]]}}}