{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,11]],"date-time":"2025-06-11T05:28:29Z","timestamp":1749619709380},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,22]],"date-time":"2024-04-22T00:00:00Z","timestamp":1713744000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,22]],"date-time":"2024-04-22T00:00:00Z","timestamp":1713744000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,22]]},"DOI":"10.1109\/vts60656.2024.10538585","type":"proceedings-article","created":{"date-parts":[[2024,5,29]],"date-time":"2024-05-29T17:24:14Z","timestamp":1717003454000},"page":"1-7","source":"Crossref","is-referenced-by-count":2,"title":["Multi-Level Reference for Test Coverage Enhancement of Resistive-Based NVM"],"prefix":"10.1109","author":[{"given":"Sina Bakhtavari","family":"Mamaghani","sequence":"first","affiliation":[{"name":"Karlsruhe Institute of Technology (KIT),Department of Computer Science,Karlsruhe,Germany"}]},{"given":"Jongsin","family":"Yun","sequence":"additional","affiliation":[{"name":"Tessent, Siemens Digital Industries Software,Wilsonville,OR,USA"}]},{"given":"Martin","family":"Keim","sequence":"additional","affiliation":[{"name":"Tessent, Siemens Digital Industries Software,Orlando,FL,USA"}]},{"given":"Mehdi","family":"Tahoori","sequence":"additional","affiliation":[{"name":"Karlsruhe Institute of Technology (KIT),Department of Computer Science,Karlsruhe,Germany"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371935"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067837"},{"volume-title":"NXP and TSMC to Deliver Industry\u2019s First Automotive 16 nm FinFET Embedded MRAM","year":"2023","key":"ref3"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.23919\/DATE56975.2023.10137267"},{"article-title":"Heterogeneous Integration in the AI Era","volume-title":"presented at the IEEE VLSI Test Symposium (VTS)","author":"Kengeri","key":"ref5"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502260"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9129130"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993454"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2020.104864"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ETS48528.2020.9131564"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7548-5_1"},{"journal-title":"Siemens Digital Industries Software","article-title":"Tessent MemoryBIST","year":"2019","key":"ref12"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2021.3078710"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2018.8624749"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2019.8791518"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2872584"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2533438"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2185930"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2412960"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2694228"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/VTS52500.2021.9794178"}],"event":{"name":"2024 IEEE 42nd VLSI Test Symposium (VTS)","start":{"date-parts":[[2024,4,22]]},"location":"Tempe, AZ, USA","end":{"date-parts":[[2024,4,24]]}},"container-title":["2024 IEEE 42nd VLSI Test Symposium (VTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10538470\/10538498\/10538585.pdf?arnumber=10538585","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,30]],"date-time":"2024-05-30T12:30:48Z","timestamp":1717072248000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10538585\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,22]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/vts60656.2024.10538585","relation":{},"subject":[],"published":{"date-parts":[[2024,4,22]]}}}