{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T17:37:56Z","timestamp":1729618676526,"version":"3.28.0"},"reference-count":46,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,6]]},"DOI":"10.1109\/wf-iot48130.2020.9221305","type":"proceedings-article","created":{"date-parts":[[2020,10,13]],"date-time":"2020-10-13T20:15:07Z","timestamp":1602620107000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications"],"prefix":"10.1109","author":[{"given":"Nazek","family":"El-Atab","sequence":"first","affiliation":[]},{"given":"Reema","family":"Suwaidan","sequence":"additional","affiliation":[]},{"given":"Yara","family":"Alghamdi","sequence":"additional","affiliation":[]},{"given":"Alhanouf","family":"Alhazzany","sequence":"additional","affiliation":[]},{"given":"Reema","family":"Almansour","sequence":"additional","affiliation":[]},{"given":"Sohail F.","family":"Shaikh","sequence":"additional","affiliation":[]},{"given":"Sherjeel","family":"Khan","sequence":"additional","affiliation":[]},{"given":"Muhammad Mustafa","family":"Hussain","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1186\/s11671-015-0957-5"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.85.085425"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1002\/aenm.201902883"},{"key":"ref32","article-title":"Ultraflexible Corrugated Monocrystalline Silicon Solar Cells with High Efficiency (19%), Improved Thermal Performance, and Reliability Using Low-Cost Laser Patterning","author":"el-atab","year":"2019","journal-title":"ACS Applied Materials & Interfaces"},{"journal-title":"Rigid-Flex PCB Design -A guidebook for designers","year":"2013","author":"jordan","key":"ref31"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2010.5469559"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1063\/1.4891050"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1088\/2053-1591\/aac98b"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.85.085425"},{"key":"ref34","doi-asserted-by":"crossref","first-page":"1879","DOI":"10.1149\/MA2014-02\/37\/1879","article-title":"Transparent graphene nanoplatelets for charge storage in memory devices","author":"nayfeh","year":"2014","journal-title":"Electrochem Soc Meeting Abstracts"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201870111"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1021\/nl401352k"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.neuron.2016.06.034"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2730678"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-71767-8_16"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1126\/science.1182383"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1317920111"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.0914031107"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2014.6894339"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2017.2747900"},{"key":"ref19","first-page":"209","article-title":"The development of IC packaging under the Internet of Things standards","author":"tai-ying","year":"2016","journal-title":"2016 11th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT)"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.08.005"},{"key":"ref4","article-title":"Room temperature multiplexed gas sensing using chemical-sensitive 3.5-nm-thin silicon transistors","volume":"3","author":"mohammad fahad","year":"2017","journal-title":"Science advances"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.200901363"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1621318114"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1617758114"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/IROS.2017.8205975"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1126\/science.aas9315"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0043-y"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1719573115"},{"key":"ref2","first-page":"1905399","article-title":"Heterogeneous Cubic Multidimensional Integrated Circuit for Water and Food Security in Fish Farming Ponds","author":"el-atab","year":"2019","journal-title":"Small"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"3921","DOI":"10.1126\/sciadv.aar3921","article-title":"Skin-interfaced systems for sweat collection and analytics","volume":"4","author":"jungil","year":"2018","journal-title":"Science advances"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/adem.201900043"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1038\/srep38712"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2016.7573394"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6528\/aa87e5"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2000.835095"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1494037"},{"key":"ref42","doi-asserted-by":"crossref","first-page":"14392","DOI":"10.1021\/ja805090z","article-title":"Solution-gated epitaxial graphene as pH sensor","volume":"130","author":"kailian ang","year":"2008","journal-title":"Journal of the American Chemical Society"},{"key":"ref24","first-page":"27","article-title":"Wafer level system integration for SiP","author":"douglas","year":"2014","journal-title":"Electron Devices Meeting (IEDM) 2014 IEEE International"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1063\/1.4819219"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.852158"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/27\/27\/275205"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.3390\/mi9060308"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.200701437"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2004.830354"}],"event":{"name":"2020 IEEE 6th World Forum on Internet of Things (WF-IoT)","start":{"date-parts":[[2020,6,2]]},"location":"New Orleans, LA, USA","end":{"date-parts":[[2020,6,16]]}},"container-title":["2020 IEEE 6th World Forum on Internet of Things (WF-IoT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9217527\/9221008\/09221305.pdf?arnumber=9221305","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,23]],"date-time":"2022-11-23T04:38:54Z","timestamp":1669178334000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9221305\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,6]]},"references-count":46,"URL":"https:\/\/doi.org\/10.1109\/wf-iot48130.2020.9221305","relation":{},"subject":[],"published":{"date-parts":[[2020,6]]}}}