{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,8]],"date-time":"2026-06-08T23:24:45Z","timestamp":1780961085453,"version":"3.54.1"},"reference-count":28,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,7,8]],"date-time":"2025-07-08T00:00:00Z","timestamp":1751932800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,8]],"date-time":"2025-07-08T00:00:00Z","timestamp":1751932800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100014188","name":"Ministry of Science and ICT","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100014188","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,7,8]]},"DOI":"10.1109\/whc64065.2025.11123341","type":"proceedings-article","created":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:18:28Z","timestamp":1755800308000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["All-in-One Haptic Thimble for Vibration, Pressure, and Thermal Feedback: Investigating the Impact of Vibration Frequency on Thermal Perception"],"prefix":"10.1109","author":[{"given":"Mohammad Shadman","family":"Hashem","sequence":"first","affiliation":[{"name":"Kyunghee University,Computer Science & Engineering,Yongin-si,Gyeonggi-do,South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ahsan","family":"Raza","sequence":"additional","affiliation":[{"name":"Kyunghee University,Computer Science & Engineering,Yongin-si,Gyeonggi-do,South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seokhee","family":"Jeon","sequence":"additional","affiliation":[{"name":"Kyunghee University,Computer Science & Engineering,Yongin-si,Gyeonggi-do,South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3389\/fpsyg.2018.02086"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3389\/frvir.2023.1242587"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1146\/annurev-control-060117-105043"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1186\/s40486-024-00199-w"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2015.10.048"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3526113.3545677"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICSJ.2018.8602567"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LSENS.2024.3358260"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2961430"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2024.3376753"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ROBOT.2005.1570171"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-017-00685-3"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/app12010175"},{"key":"ref14","volume-title":"Eontex high-conductivity heater fabric-nw170-pi-20","year":"2018"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2025.3549677"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/s00420-007-0266-0"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1093\/occmed\/kqp032"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/WHC.2009.4810902"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2017-74179"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-031-70061-3_13"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/3654777.3676460"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISMAR62088.2024.00076"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/WHC.2017.7989882"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.brainres.2009.09.037"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.3758\/BF03204192"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.3758\/BF03214234"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2910036"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1162\/105474603321640923"}],"event":{"name":"2025 IEEE World Haptics Conference (WHC)","location":"Suwon, Korea, Republic of","start":{"date-parts":[[2025,7,8]]},"end":{"date-parts":[[2025,7,11]]}},"container-title":["2025 IEEE World Haptics Conference (WHC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11123178\/11123180\/11123341.pdf?arnumber=11123341","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T05:32:51Z","timestamp":1755840771000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11123341\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7,8]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/whc64065.2025.11123341","relation":{},"subject":[],"published":{"date-parts":[[2025,7,8]]}}}