{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T16:36:16Z","timestamp":1730306176802,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,12]]},"DOI":"10.1109\/wsc.2011.6147906","type":"proceedings-article","created":{"date-parts":[[2012,2,9]],"date-time":"2012-02-09T17:20:26Z","timestamp":1328808026000},"page":"1921-1926","source":"Crossref","is-referenced-by-count":2,"title":["Application of tool science techniques to improve tool efficiency for a dry etch cluster tool"],"prefix":"10.1109","author":[{"given":"Robert","family":"Havey","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lixin","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"DongJin","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/66.705374"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/5.24143"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/70.964658"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICSMC.2001.972979"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.831524"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/WSC.2008.4736310"},{"key":"ref1","first-page":"411","article-title":"Coping with the High Cost of Wafer Fabs","volume":"18","author":"burggraaf","year":"0","journal-title":"Semicond Int"}],"event":{"name":"2011 Winter Simulation Conference - (WSC 2011)","start":{"date-parts":[[2011,12,11]]},"location":"Phoenix, AZ, USA","end":{"date-parts":[[2011,12,14]]}},"container-title":["Proceedings of the 2011 Winter Simulation Conference (WSC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6135535\/6147014\/06147906.pdf?arnumber=6147906","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T14:55:32Z","timestamp":1490108132000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6147906\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,12]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/wsc.2011.6147906","relation":{},"subject":[],"published":{"date-parts":[[2011,12]]}}}